Backside Power Delivery Cooling Module for Dual-Sided Heat Dissipation
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Solution Overview
Problem
The relocation of power delivery lines to the backside of the substrate in backside power delivery systems introduces the need for effective thermal management, as power supply components dissipate significant thermal energy, necessitating advanced cooling solutions.
Innovation Solution
A cooling module is designed for backside power delivery systems, comprising cooling components on both sides of the substrate to manage heat generated by electronic components, utilizing various cooling mechanisms such as cold plates, heat sinks, heat pipes, and thermal pads, secured with fasteners and locking members for efficient heat exchange and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power delivery lines are relocated to the backside of the substrate, then routing efficiency and power consumption are improved, but thermal management complexity increases
Solution Approach 1:
The patent applies backside power delivery by moving power delivery lines from the front side to the backside of the substrate, utilizing the z-dimension (vertical space) to resolve routing conflicts. This dimensional transition enables separation of power and signal lines, reducing interference and improving routing efficiency while managing power consumption.
Solution Approach 2:
The patent introduces cooling components as intermediary elements between the power supply components and the external environment. These cooling components act as mediators to transfer heat away from the backside of the substrate, thereby managing the thermal complexity introduced by backside power delivery without compromising the routing benefits.
2Productivity
If power supply components are placed on the backside of the substrate, then routing efficiency is improved, but heat dissipation becomes more challenging
Solution Approach 1:
By placing power supply components on the backside of the substrate and associating cooling components with these backside components, the patent utilizes the vertical dimension to separate power delivery routing from signal routing, improving routing efficiency. Simultaneously, the cooling components address heat dissipation challenges by providing dedicated thermal management pathways from the backside location.
Solution Approach 2:
The patent segments the substrate into front side and back side functional zones. Power supply components and their associated cooling components are placed on the backside, while signal processing components remain on the front side. This spatial segmentation enables improved routing efficiency for power delivery while isolating heat generation and dissipation to specific zones that can be managed independently.
3Temperature
If cooling components are added to manage heat from power supply components, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent merges the power supply component and its associated cooling component into an integrated backside power module. By combining these functions at the same location on the backside of the substrate, the patent improves temperature control for power supply components while minimizing the increase in overall device complexity through functional integration rather than separate distributed components.
Solution Approach 2:
The cooling components are directly associated with and serve the power supply components that generate heat. Each power supply component has its own dedicated cooling component on the backside, creating a self-service thermal management system where heat-generating elements are immediately cooled by adjacent cooling structures, improving temperature control efficiency while avoiding complex centralized cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling module effectively maintains optimal operating temperatures of electronic components, enhancing system performance and efficiency by continuously removing heat generated by power supply components and other electronic elements.
Implementation Method 1
a first cooling component (3) arranged on the first electronic component (C1)... a second cooling component (4) arranged on the second electronic component (C2)
Implementation Method 2
utilizing various cooling mechanisms such as cold plates, heat sinks, heat pipes, and thermal pads
Implementation Method 3
utilizing various cooling mechanisms such as cold plates, heat sinks, heat pipes, and thermal pads
Data Source
AI summary
A cooling technology for a backside power delivery system is provided. In some embodiments, the backside power delivery system includes a substrate, a first electronic component and a second electronic component. The substrate includes a front side and a back side. The first electronic component is arranged on the front side, and the second electronic component is arranged on the back side. A first cooling component is arranged on the first electronic component, and a second cooling component is arranged on the second electronic component. The second electronic component may be a power supply component.