Backside Patterned Power Die for Damage-Free Singulation
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Solution Overview
Problem
Existing singulation techniques for power devices, such as dicing and laser ablation, often damage the substrate and conductive layers, leading to delamination and failed electrical properties.
Innovation Solution
The electronic device includes a power die with a patterned conductive structure on its backside surface, which is indented from the lateral surface, allowing for a non-damaging singulation process that prevents delamination and maintains electrical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dicing or laser ablation techniques are used to separate power devices, then singulation can be achieved, but the substrate and conductive layer are damaged leading to delamination and failed electrical properties
Solution Approach 1:
A patterned layer is formed on the backside surface of the substrate before the singulation process. This patterned layer serves as a protective structure that prevents damage to the conductive layer during subsequent dicing or laser ablation processes, thereby maintaining electrical integrity while enabling efficient device separation
Solution Approach 2:
The patterned layer acts as an intermediary protective structure between the conductive layer and the mechanical or thermal stresses of the singulation process. This intermediate layer absorbs or distributes the stress, preventing direct damage to the conductive layer and substrate interface, thus avoiding delamination and electrical property failures
2Productivity
If dicing or laser ablation techniques are used to separate power devices, then singulation can be achieved, but delamination occurs due to substrate and conductive layer damage
Solution Approach 1:
A patterned layer is formed on the backside surface of the substrate before the singulation process. This patterned layer serves as a protective structure that prevents damage to the conductive layer during subsequent dicing or laser ablation processes, thereby maintaining electrical integrity while enabling efficient device separation
Solution Approach 2:
The patterned layer provides beforehand cushioning by being positioned between the conductive layer and the mechanical or thermal stresses of the singulation process. This protective layer absorbs or distributes stress, preventing direct damage to the conductive layer and substrate interface, thus avoiding delamination and electrical property failures
Data Source
AI summary
The present disclosure provides an electronic device and a method of manufacturing the same. The electronic device includes a power die and a patterned layer. The power die has a front surface, a backside surface, and a lateral surface extending between the front surface and the backside surface. The patterned layer is disposed on the backside surface. The patterned layer is indented from the lateral surface of the power die.