Backside Power Grid Layout for Semiconductor Signal Routing
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Solution Overview
Problem
The increasing miniaturization of semiconductor integrated circuits (ICs) leads to insufficient metal routing for signal connections, which hinders further size reduction and complexity advancements.
Innovation Solution
The introduction of a semiconductor device design that incorporates a power grid structure on the backside of the substrate, allowing for the use of metal strips above source/drain regions for signal connections, and the implementation of isolation layers to facilitate these connections without obstructing the routing, thereby providing additional resources for signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If functional density is increased to achieve smaller and more complex circuits, then circuit capability is improved, but metal routing space becomes insufficient
Solution Approach 1:
The patent introduces a backside power grid structure that utilizes the rear surface of the semiconductor substrate for power distribution. This dimensional transition from planar (top-side only) to three-dimensional (both sides of substrate) routing provides additional metal routing space without increasing the chip's footprint area, thereby resolving the contradiction between increased functional density and limited routing space.
2Length of moving object
If geometry size is decreased to enable further miniaturization, then device size is reduced, but metal routing space becomes insufficient
Solution Approach 1:
By implementing power distribution networks on both the front and back sides of the substrate, the patent effectively doubles the available routing area. This allows continued miniaturization of individual geometry features while maintaining sufficient total metal routing space through the additional dimensional resource of the substrate's second surface.
3Adaptability or versatility
If metal routing space is increased to support signal connections, then routing capability is improved, but substrate area is consumed
Solution Approach 1:
The patent segments the power distribution function from the signal routing function by dedicating the backside substrate to power grids and the front side to signal routing. This functional segmentation allows metal routing resources to be optimized for their specific purposes without competing for the same substrate area, thereby improving overall routing capability without additional area consumption.
Data Source
AI summary
A semiconductor device, including: a transistor layer, including a first active region configured to be a source/drain terminal of a first transistor and a second active region configured to be a source/drain terminal of a second transistor; a dielectric layer, disposed on the source/drain terminals of the first and second transistors; a conductive strip, included in the dielectric layer and extending from the first active region toward the second active region for signal connection.