Backside Power Delivery Network for Low-Voltage-Drop IC Routing
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Solution Overview
Problem
Existing power delivery networks in integrated circuits face challenges in efficiently delivering power with minimal voltage drop and heat dissipation, particularly due to the competition between power and signal routing on the front side of the device die.
Innovation Solution
A backside power delivery network is implemented, where power is received and distributed from the front side of the device die to the backside, utilizing a front-side interconnect structure and a backside redistribution layer to improve heat dissipation and reduce voltage drop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power is routed on the front side of the device die, then power delivery is achieved, but voltage drop increases and heat dissipation is compromised
Solution Approach 1:
The patent moves power routing from the front side to the back side of the device die, utilizing the third dimension (depth/thickness) to resolve the conflict between power delivery and heat dissipation. The back side is dedicated exclusively to power routing while the front side handles signal routing, eliminating competition for routing resources and improving both voltage drop and heat dissipation performance.
Solution Approach 2:
The device die is segmented into two distinct sides with specialized functions: the front side for signal routing and the back side for power routing. This segmentation allows each side to be optimized independently, with the back side featuring dedicated power delivery networks that minimize voltage drop and provide better thermal management.
2Area of stationary object
If power and signal routing share the front side, then device functionality is achieved, but routing space is limited and performance degrades
Solution Approach 1:
The patent utilizes the back side of the device die as an additional routing dimension, effectively doubling the available routing space. By moving power routing to the back side, the front side is freed up for signal routing, eliminating resource competition and improving overall device performance and reliability.
Solution Approach 2:
The routing function is segmented into two separate domains: signal routing on the front side and power routing on the back side. This segmentation provides ample space for each routing type without interference, ensuring optimal performance for both signal integrity and power delivery.
3Productivity
If backside power delivery is implemented, then power routing efficiency is improved, but additional manufacturing steps are required
Solution Approach 1:
The patent incorporates power delivery network formation as an early step in the manufacturing process, performing backside thinning and power routing structure creation before final device assembly. This preliminary action integrates the complex backside power delivery features into the standard manufacturing flow, improving power delivery efficiency while managing manufacturing complexity through process integration.
Data Source
AI summary
A method includes forming integrated circuit devices comprising a transistor formed at a top surface of a semiconductor substrate of a wafer, forming a front-side interconnect structure over and connecting to the integrated circuit devices, forming an electrical connector over and connecting to the front-side interconnect structure, performing a backside grinding process to thin the semiconductor substrate, and forming a backside interconnect structure on a backside of the integrated circuit devices. The backside interconnect structure includes a power delivery network, and is configured to receive a positive power supply voltage from the electrical connector and redistributes the positive power supply voltage to the integrated circuit devices.