Single Backside Power Plane for Nanosheet Power Delivery
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Solution Overview
Problem
As nanosheet technology scales down, delivering power efficiently to smaller devices becomes challenging due to interference between devices, making it difficult to achieve effective power delivery.
Innovation Solution
A microelectronic structure with a single continuous metal layer backside power plane connected to backside contacts, formed simultaneously during metallization, reduces the number of metal layers, improves resistance, and separates VDD and VSS connections between the frontside and backside, allowing for efficient power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple metal layers are used for backside power and ground connections, then power delivery capability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the backside power plane and ground plane into a single metal layer, eliminating the need for separate metal layers for each function. This merging approach maintains adequate power and ground connections while reducing manufacturing complexity and cost associated with multiple metal layers.
Solution Approach 2:
The single metal layer on the backside serves multiple functions by providing both power and ground connections through a unified structure. This multi-functional design simplifies the overall device architecture while maintaining the necessary electrical connectivity for power delivery.
2Quantity of substance
If devices are scaled down and placed closer together, then device density is improved, but power delivery efficiency deteriorates due to interference
Solution Approach 1:
The patent moves power and ground connections to the backside of the device, utilizing the third dimension (depth/vertical space) to separate power delivery paths from signal interference zones. This dimensional reorganization allows higher device density on the frontside while maintaining efficient power delivery through backside connections.
Solution Approach 2:
The patent segments power and ground connections by providing dedicated backside contacts for each function, separated from the frontside signal interconnects. This segmentation reduces electromagnetic interference between power lines and signal lines, improving power delivery efficiency even as devices are scaled down and placed closer together.
3Quantity of substance
If frontside contacts are used for both power and signal connections, then interconnect density is improved, but power delivery performance deteriorates
Solution Approach 1:
The patent segments the interconnect functions by providing separate frontside contacts for signal connections and separate backside contacts for power connections. This functional segmentation ensures that power delivery paths are optimized independently from signal interconnect density, preventing power performance degradation even as interconnect density increases.
Solution Approach 2:
The patent utilizes the backside dimension to accommodate power connections, freeing up the frontside for optimized signal interconnects. This dimensional separation allows the frontside to achieve high interconnect density for signals while the backside handles power delivery, with each optimized for its specific function without mutual interference.
Data Source
AI summary
A microelectronic structure including a plurality of electronic devices. A plurality of frontside contacts, where each of the plurality of frontside contacts is connected to a frontside of one of the plurality electronic devices, respectively. Each of the plurality of frontside contacts is a same first electric potential. A plurality of backside contacts, where the plurality of backside contacts is connected to a backside of one of the plurality of electronic devices, respectively. Each of the plurality of backside contacts is a same second electrical potential, where the first electrical potential is different than the second electrical potential.