Backside Power Routing for Multi-Voltage IC Voltage Drop Reduction
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Solution Overview
Problem
Integrated circuits face challenges in efficiently providing multiple supply voltages, particularly when devices require positive, negative, and source supply voltages, leading to voltage drops and reduced reliability.
Innovation Solution
The integrated circuit design includes backside patterns in a wiring layer on the substrate's backside to efficiently supply multiple voltages, with conductive patterns overlapping and arranged at specific heights to minimize voltage drops, and cells are rearranged to optimize power distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple supply voltages are provided through conventional wiring patterns, then devices can receive power, but voltage drops occur and reliability is reduced
Solution Approach 1:
The patent utilizes the backside of the substrate as an additional dimension for power distribution. By forming backside patterns on the rear surface of the substrate and routing them perpendicular to the front-side wiring, the invention creates a three-dimensional power delivery network that reduces current path length and minimizes voltage drops while improving power supply reliability.
2Reliability
If backside patterns are added to provide multiple supply voltages, then voltage distribution is improved, but device complexity increases
Solution Approach 1:
The patent segments the power distribution function by separating front-side and back-side wiring layers. Each layer handles specific voltage rails (e.g., VDD, VDDH on front side; VSS, VSSL on back side), allowing independent optimization of each wiring layer and reducing the complexity burden on any single layer while maintaining multiple voltage supply capability.
3Productivity
If cells are rearranged to overlap with backside patterns, then power distribution efficiency is optimized, but placement complexity increases
Solution Approach 1:
The patent applies local quality optimization by allowing cells to overlap with specific backside patterns based on their power requirements. Cells requiring high voltage (VDDH) are positioned to overlap with corresponding backside patterns, while other cells follow different placement rules. This localized placement strategy optimizes power distribution efficiency without requiring complete redesign of the entire cell layout.
Data Source
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Figure 1B
Figure 2A
AI summary
An integrated circuit comprising: a plurality of devices arranged on a front side of a substrate; a first backside pattern and a second backside pattern, wherein the first backside pattern and the second backside pattern extend in a first direction along a first track in a first backside wiring layer, wherein the first backside wiring layer is on a back side of the substrate, and wherein the first backside pattern and the second backside pattern are configured to receive a first supply voltage and provide the first supply voltage to at least one of the plurality of devices; and a third backside pattern extending in the first direction along the first track between the first backside pattern and the second backside pattern, in the first backside wiring layer, wherein the third backside pattern is configured to receive a source supply voltage and provide the source supply voltage to a first device of the plurality of devices.