Backside Power Delivery Stack for Warpage and Thermal Control
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Solution Overview
Problem
As computing platforms integrate more integrated circuit devices, issues with warpage, power delivery, and thermal management arise, necessitating high-performance architectures that address these challenges.
Innovation Solution
The implementation of backside power delivery architectures with stacked integrated circuit devices, utilizing a glass core interposer, redistribution layers, and thermal management solutions like copper slugs and active thermal solutions, to enhance power delivery and thermal management while maintaining structural integrity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If more integrated circuit devices are integrated into a single package, then performance and functionality are improved, but warpage and structural integrity deteriorate
Solution Approach 1:
The patent transitions from planar integration to three-dimensional stacked integration, moving devices vertically above each other rather than horizontally adjacent. This dimensional change allows higher density and performance while distributing mechanical stress across multiple layers, reducing warpage issues associated with traditional 2D scaling.
Solution Approach 2:
The package is segmented into multiple stacked layers with individual integrated circuit devices positioned at different vertical levels. Each device can be independently managed for thermal and structural purposes, allowing warpage control at each layer while maintaining overall package integrity through the interposer structure.
2Adaptability or versatility
If more integrated circuit devices are integrated into a single package, then functionality is improved, but power delivery issues arise
Solution Approach 1:
A glass core interposer serves as an intermediary substrate that facilitates power delivery to stacked devices. The interposer contains embedded conductive structures and power distribution networks that efficiently route power vertically through the stack, solving the power delivery challenges inherent in high-density 3D integration.
Solution Approach 2:
The interposer utilizes composite structures combining glass core with embedded conductive materials and dielectric layers. This composite approach provides both mechanical support and efficient power distribution pathways, enabling reliable power delivery to multiple stacked devices simultaneously.
3Productivity
If more integrated circuit devices are integrated into a single package, then performance is improved, but thermal management becomes more difficult
Solution Approach 1:
Heat is extracted from each stacked device through dedicated thermal management structures integrated into the interposer and package substrate. Thermal vias and heat spreaders are positioned to actively remove heat at each layer, preventing thermal accumulation that would otherwise occur in densely stacked configurations.
Solution Approach 2:
The interposer acts as a thermal intermediary, providing thermal pathways and heat dissipation structures between stacked devices and the external environment. Embedded thermal management features in the interposer facilitate heat transfer from high-power devices without compromising electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more complex, higher-power devices with improved thermal management, power delivery, and reliability, supporting enhanced features and performance in computing platforms.
Implementation Method 1
a glass core interposer
Implementation Method 2
thermal management solutions like copper slugs
Data Source
AI summary
An apparatus is provided which comprises: an integrated circuit logic device, an integrated circuit power device conductively coupled with a first surface of the integrated circuit logic device, wherein the integrated circuit power device extends laterally beyond a side of the integrated circuit logic device, one or more vias adjacent the side of the integrated circuit logic device extending from contact with the integrated circuit power device to level with a second surface of the integrated circuit logic device opposite the first surface of the integrated circuit logic device, and conductive contacts on the second surface of the integrated circuit logic device. Other embodiments are also disclosed and claimed.