Backside Image Sensor and Processor Die Bonding for Low-Latency Cameras
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Solution Overview
Problem
Conventional image sensor devices experience signal propagation delays due to the separation between the image sensor device and its associated controller or image processor chips, which affects camera performance.
Innovation Solution
The integration of an image sensor device and a processor or controller die within a common package, where the image sensor die and processor die are bonded using dielectric layers with metallic pads for direct electrical connectivity, reducing the need for separate chips and thus minimizing signal propagation delays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the image sensor device is coupled to separate controller and image processor chips, then the functional separation allows for specialized processing, but the distance between components causes signal propagation delays that negatively impact camera performance
Solution Approach 1:
The patent combines the image sensor device, controller chip, and image processor chip into a single integrated package. The controller die and image processor die are mounted on the same substrate as the image sensor die, with electrical connections established through conductive vias and trace patterns on the substrate. This integration eliminates the need for external connections between separate chips, thereby reducing signal propagation delay and improving camera performance.
2Adaptability or versatility
If separate chips are used for image sensor, controller, and image processor, then each component can be optimized independently, but the overall device size and complexity increase
Solution Approach 1:
The patent implements a nested structure where the controller die and image processor die are mounted on the same substrate as the image sensor die. The substrate acts as a carrier that hosts multiple functional dies in a compact arrangement. This nesting approach allows each component to maintain its optimized design while being integrated into a unified package, reducing the overall device complexity compared to using completely separate external chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces signal propagation delays and allows for a more compact, high-performance camera system by directly connecting the image sensor and processor elements, enhancing the overall camera functionality.
Implementation Method 1
The reconstituted wafer and the image sensor wafer are bonded to one another including coupling the first surface of the first dielectric layer and the second surface of the second dielectric layer
Data Source
AI summary
Methods of forming a back side image sensor device, as well as back side image sensor devices formed, are disclosed. In one such a method, an image sensor wafer having a first dielectric layer with a first surface is obtained. A reconstituted wafer having a processor die and a second dielectric layer with a second surface is obtained. The reconstituted wafer and the image sensor wafer are bonded to one another including coupling the first surface of the first dielectric layer and the second surface of the second dielectric layer. In another method, such formation is for a processor die bonded to an image sensor wafer. In yet another method, such formation is for a processor die bonded to an image sensor die.