Backside Image Sensor Wafer Bonding for Low-Latency Processing
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Solution Overview
Problem
Conventional image sensor devices experience signal propagation delays due to the separation of the image sensor device and its associated controller or image processor chips, which negatively impacts camera performance.
Innovation Solution
The integration of an image sensor device and a processor or controller die within a common package, where the image sensor die is bonded to a processor die using a reconstituted wafer or die-to-wafer bonding method, with metallic pads for direct electrical connectivity, reducing the distance between the image sensor and processing units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the image sensor device is coupled to a separate controller chip, then the controller can independently control sensor sensing time and thresholds, but signal propagation delay increases negatively impacting camera performance
Solution Approach 1:
The patent merges the image sensor device and controller chip into a single integrated device, combining the sensor array, dielectric layers, and controller circuits in one package. This integration eliminates the physical separation between sensor and controller, thereby reducing signal propagation delay while maintaining the controller's ability to independently manage sensing parameters through on-chip circuitry
2Ease of manufacture
If the image sensor device is coupled to a separate controller chip, then the controller can be independently designed and manufactured, but the distance between components increases causing signal propagation delay
Solution Approach 1:
The patent combines multiple functional components (image sensor array, dielectric layers with metallic pads, and controller circuits) into a single integrated device structure. The controller is fabricated on the same substrate as the sensor elements, reducing inter-component distance to minimal trace lengths while allowing independent design of sensor and controller regions during the manufacturing process
3Adaptability or versatility
If multiple separate chips are used for image sensor, driver, and image processor, then each chip can be optimized for its specific function, but the overall device complexity and propagation delay increase
Solution Approach 1:
The patent integrates the image sensor array, driver circuits, and image processor into a single device with multiple functional regions on one substrate. Each functional block maintains its specialized design characteristics while being physically combined, reducing the system from multiple separate chips to one integrated device that preserves functional optimization benefits
Solution Approach 2:
The integrated device performs multiple functions within a single package: the sensor array captures images, the driver circuits control sensor operation, and the image processor handles signal processing. This multi-functional integration reduces the number of separate components while maintaining specialized functionality for each task
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces signal propagation delay and allows for a more compact, high-performance camera system by minimizing the distance between the image sensor and processing elements, enhancing overall camera functionality.
Implementation Method 1
The reconstituted wafer and the image sensor wafer are bonded to one another including coupling the first surface of the first dielectric layer and the second surface of the second dielectric layer
Data Source
AI summary
Methods of forming a back side image sensor device, as well as back side image sensor devices formed, are disclosed. In one such a method, an image sensor wafer having a first dielectric layer with a first surface is obtained. A reconstituted wafer having a processor die and a second dielectric layer with a second surface is obtained. The reconstituted wafer and the image sensor wafer are bonded to one another including coupling the first surface of the first dielectric layer and the second surface of the second dielectric layer. In another method, such formation is for a processor die bonded to an image sensor wafer. In yet another method, such formation is for a processor die bonded to an image sensor die.