Backside Substrate Cleaning Apparatus for Particle Removal
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Solution Overview
Problem
The presence of particles on the backside of substrates during microelectronic device processing leads to defects and yield reduction, as these particles can be generated during chamber processing and handling, and can spread to other processing locations, causing unpredictable contamination.
Innovation Solution
An apparatus and method for removing particles from the backside of substrates, involving a substrate handler to expose the surface, a particle separator to separate particles using electrostatic attraction or ionized gas, a particle transporter to move the separated particles, and a particle collector to capture them, minimizing re-contamination and increasing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrate processing is performed in chamber using pedestal support, then substrate processing function is achieved, but particles are generated on substrate backside due to trapped residues and micro-scratches
Solution Approach 1:
The patent extracts the substrate backside cleaning function from the main processing chamber by implementing a separate cleaning station. The substrate is transferred to this dedicated cleaning station where particles on the backside are removed through controlled contact with cleaning surfaces, thereby separating the cleaning operation from the processing operation and eliminating particle generation during processing.
Solution Approach 2:
The patent introduces an intermediary cleaning station between the processing chamber and the next processing location. This cleaning station acts as a mediator that removes particles from the substrate backside before the substrate is transferred out, preventing particle spread to other locations while maintaining the efficiency of the overall processing system.
2Reliability
If particles are removed from substrate backside, then yield is improved, but additional cleaning equipment and process steps are required
Solution Approach 1:
The patent designs the cleaning station with multi-functional capabilities. The same cleaning surfaces and mechanisms are used for both particle removal and substrate handling, consolidating multiple functions into a single integrated system. This reduces the overall equipment complexity while maintaining the particle removal function that improves yield.
Solution Approach 2:
The patent combines the substrate transfer function with the cleaning function in a single integrated station. The substrate is transferred to the cleaning station and cleaned in the same operational sequence, merging two separate processes into one unified operation. This integration reduces the number of discrete equipment components and simplifies the overall system architecture.
3Object-generated harmful factors
If substrate is handled with minimal contact, then particle generation is reduced, but substrate positioning and stability become more difficult
Solution Approach 1:
The patent applies local quality by providing contact only at specific edge locations of the substrate rather than across the entire surface. The cleaning surfaces and handling mechanisms contact only the peripheral edges of the substrate, minimizing the contact area and thus reducing particle generation from trapped residues, while still maintaining adequate positioning and stability through these localized contact points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes particles from the substrate backside without re-contaminating the substrate or processing equipment, enhancing the yield of microelectronic device production by minimizing particle spread and contamination risks.
Implementation Method 1
a particle separator to separate particles using electrostatic attraction or ionized gas
Implementation Method 2
a particle separator to separate particles using electrostatic attraction or ionized gas
Data Source
AI summary
Embodiments of methods and apparatus for removing particles from a surface of a substrate, such as from the backside of the substrate, are provided herein. In some embodiments, an apparatus for removing particles from a surface of a substrate includes: a substrate handler to expose the surface of the substrate; a particle separator to separate particles from the exposed surface of the substrate; a particle transporter to transport the separated particles; and a particle collector to collect the transported particles.