Backside Torsion IC Carrier for Large-Package Retention
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Solution Overview
Problem
Existing electronic device supports face challenges in securely retaining and supporting internal hardware components like CPUs and GPUs due to space constraints and mechanical load requirements, particularly in large form factor packages, while also ensuring proper alignment and preventing signal degradation.
Innovation Solution
The development of IC carriers with thinner, stronger support features that allow for automated insertion and retention mechanisms, including torsion loading mechanisms on PCBs, which enable increased mechanical load support and thermal interface capabilities within compact geometries, and the use of gear/sprocket transmission assemblies for robust retention and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional support structures are used for ICs, then mechanical support is provided, but the support features become thick and require manual assembly
Solution Approach 1:
The support features transition from thick, rigid structures to thin, flexible structures capable of elastic deformation. This parameter change in thickness and flexibility enables automated insertion while maintaining mechanical support functionality, as the flexible supports can deform during insertion and return to their original shape to provide support.
Solution Approach 2:
The support features are designed to be dynamically flexible rather than statically rigid. The flexible supports can adapt their shape and position during the insertion process, allowing automated placement equipment to insert ICs without manual intervention, while still providing stable support once the IC is in place.
2Reliability
If retention mechanisms are added to secure ICs, then retention capability is improved, but the risk of IC tilting during insertion increases
Solution Approach 1:
The retention clips are designed with spring-loaded or flexible elements that provide gradual, cushioned engagement with the IC. This beforehand cushioning prevents sudden impacts or tilting during insertion by allowing the retention mechanism to flex and absorb insertion forces, ensuring the IC remains properly aligned throughout the process.
Solution Approach 2:
The retention mechanism applies localized support and constraint forces at specific points on the IC package. By providing retention capability at key locations while maintaining flexibility elsewhere, the mechanism prevents IC tilting during insertion while still securing the IC firmly in its final position.
3Strength
If PCB space is increased to accommodate support structures, then mechanical support is improved, but the overall device size increases
Solution Approach 1:
The support features are implemented as thin, flexible structures that provide substantial mechanical support capability despite their minimal thickness and footprint on the PCB. These flexible supports achieve high strength-to-area ratios by utilizing elastic deformation and distributed stress patterns, enabling strong mechanical support without occupying significant PCB area.
4Manufacturing precision
If manual assembly processes are used for IC installation, then precision is maintained, but productivity and inventory management complexity increase
Solution Approach 1:
The retention clips are designed to automatically engage with the IC package through self-aligning features and elastic deformation. The flexible supports and retention mechanism work together to self-adjust during automated insertion, eliminating the need for manual positioning or adjustment, thereby enabling high-speed automated assembly while maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for secure retention of larger ICs without tilting, increased mechanical and thermal performance, and reduced signal degradation by enabling more flexible and adaptive pin layouts, while minimizing the need for manual assembly and inventory management.
Implementation Method 1
the second support feature includes a torsion wire that provides rotational flexibility to the frame
Implementation Method 2
a torsion loading mechanism on a second side of the PCB opposite the first side, the torsion loading mechanism to support the component through the PCB
Data Source
AI summary
Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices. An example support includes an integrated circuit (IC) carrier that includes a plurality of walls, supports carried by the walls to support an IC from below the IC, and a retention clip to secure the IC.