Integrated Circuit Backside Routing to Reduce Parasitic Coupling
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Solution Overview
Problem
The increasing complexity and density of integrated circuits lead to manufacturing challenges, including increased parasitic capacitance and defects due to crowded interconnect structures, which affect performance and reliability.
Innovation Solution
The implementation of backside routing tracks and via connectors reduces the complexity of interconnect structures on the top side of integrated circuits, allowing for more space between topside interconnects, thereby reducing parasitic capacitance and improving manufacturing flexibility by reconfiguring signal phases on adjacent routing tracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If standard cell layout designs are miniaturized to provide more functionality at higher speeds, then device functionality and speed are improved, but parasitic capacitance and manufacturing defects increase due to crowded interconnect structures
Solution Approach 1:
The patent introduces backside routing tracks on the opposite side of the substrate from the standard cell logic circuitry. This utilizes the third dimension (substrate thickness) to create additional routing space, allowing interconnects to be distributed across both sides of the substrate rather than confined to a single plane, thereby reducing crowding and parasitic capacitance while maintaining miniaturization benefits
2Adaptability or versatility
If interconnect structures are made denser to increase functionality, then device functionality is improved, but parasitic capacitance between adjacent routing tracks increases
Solution Approach 1:
The routing functionality is segmented into two separate locations: topside routing tracks and backside routing tracks. By dividing the interconnect structure across both sides of the substrate, the patent reduces the density and spacing requirements on each individual side, thereby reducing parasitic capacitance between adjacent routing tracks while maintaining overall device functionality
3Adaptability or versatility
If more routing tracks are placed on the top side to increase functionality, then device functionality is improved, but manufacturing complexity and defects increase due to crowded structures
Solution Approach 1:
The patent utilizes the backside of the substrate as an additional dimensional space for routing tracks. This allows manufacturing processes to distribute interconnect structures across both sides of the substrate, reducing crowding on the topside and improving manufacturability while maintaining the ability to implement complex functional designs
Data Source
AI summary
An integrated circuit includes a first transistor, a horizontal routing track extending in a first direction in a first metal layer, and a via connector conductively connecting the horizontal routing track to a first terminal of the first transistor. The integrated circuit also includes a backside routing track extending in the first direction in a backside metal layer, and a backside via connector conductively connecting the backside routing track to a second terminal of the first transistor. The backside metal layer and the first metal layer are formed at opposite sides of a semiconductor substrate. In the integrated circuit, either the first terminal or the second terminal is a gate terminal of the first transistor.