Backside Voltage Routing for GAA Isolation Transistor Cells

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Solution Overview

Problem

As integrated circuit technologies progress towards smaller technology nodes, gate-all-around (GAA) transistors face challenges with VDD and VSS power routing, which consumes excessive routing resources, impacting cell scaling and performance.

Innovation Solution

The implementation of circuit cells with continuous active areas, where source/drain features and channels of functional transistors are connected with those of isolation transistors, along with voltage lines under both types of transistors, reduces routing complexity and improves cell performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional separate routing for functional transistors and isolation transistors is used, then routing is simpler, but routing resources are excessive and cell scaling is impacted

Engineering Contradiction:
Improvecell scaling efficiencyVSAvoidrouting complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent merges the routing of functional transistors and isolation transistors by implementing a shared voltage line structure where both transistor types connect to the same voltage line through respective contact structures, eliminating the need for separate routing paths and reducing overall routing complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The voltage line is designed to serve multiple functions simultaneously: it provides voltage supply to both functional transistors and isolation transistors, acts as a common electrical connection for different device types, and reduces the total number of routing resources required in the circuit cell

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If continuous active areas are implemented connecting functional and isolation transistors, then transistor performance is enhanced, but manufacturing precision requirements increase

Engineering Contradiction:
Improvetransistor performanceVSAvoidcontinuous active area connectivity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent implements preliminary action by forming the continuous active area structure and voltage line configuration during the fabrication process before final device operation, ensuring proper electrical connectivity and performance characteristics are established during manufacturing

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The voltage line acts as an intermediary element that connects both functional and isolation transistors through contact structures, facilitating proper electrical connectivity and enabling the continuous active area configuration to achieve enhanced transistor performance

Inventive Principle:
Principle #24Intermediary (Mediator)

3Power

If more routing resources are allocated for VDD and VSS power routing, then power delivery is improved, but cell scaling and density are reduced

Engineering Contradiction:
Improvepower routing capabilityVSAvoidcell area
Core Design Contradiction:
PowerVSArea of moving object

Solution Approach 1:

The patent combines the power routing for VDD and VSS into a shared voltage line infrastructure where both functional and isolation transistors draw power from the same routing resources, significantly reducing the total area required for power distribution while maintaining adequate power delivery capability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes vertical dimensionality by implementing contact structures that extend through dielectric layers to reach the voltage line, allowing three-dimensional power distribution that reduces planar routing area requirements while maintaining effective power delivery to all transistor types

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12176411B2Semiconductor device with isolation transistors and back side voltage metal lines
Publication Date: 2024.12.24 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12176411B2 patent drawing
  • US12176411B2 patent drawing
  • US12176411B2 patent drawing

AI summary

A semiconductor device includes circuit cells, isolation transistors at cell boundaries of the circuit cells, a first metal line under the isolation transistors, and connection structures connecting gate structures of the isolation transistors to the first metal line. Each of the circuit cells includes functional transistors having source/drain features and nanostructures. The isolation transistors electrically isolate the circuit cells from each other. Nanostructures of the isolation transistors, the source/drain features of the functional transistors, and the nanostructures of the functional transistors are connected with each other into a continuous rectangular shape from a top view.