Backup Circuit Placement for Shaped Display Panel Cutting Yield

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Solution Overview

Problem

The cutting process for shaped display panels often results in damaged driving circuits, leading to operational issues and low yield, as the existing methods lack effective protection for the circuits during the cutting of large panels into shaped forms.

Innovation Solution

Incorporating a backup circuit on the peripheral area of the device substrate, electrically connected to the auxiliary circuit, which receives the same signal as the auxiliary circuit, ensuring that even if the auxiliary circuit is damaged during cutting, the backup circuit can continue to function and maintain the operation of the driving units.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a large panel is cut to obtain a shaped display panel, then the cost of photomask is saved and manufacturing flexibility is improved, but the driving circuit may be damaged in the cutting process leading to low yield

Engineering Contradiction:
Improveshaping flexibilityVSAvoiddriving circuit integrity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies preliminary action by pre-positioning backup circuits in the peripheral area before the cutting process. These backup circuits are strategically placed and configured to take over immediately if the primary driving circuits are damaged during cutting, thus preventing yield loss while maintaining shaping flexibility

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements beforehand cushioning by creating a backup circuit system that serves as a safety buffer against cutting damage. The backup circuits are prepared in advance with appropriate electrical connections and positioning, providing a protective mechanism that absorbs the potential harm of cutting-induced circuit damage

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Device complexity

If the auxiliary circuit is placed on the peripheral area overlapping the cutting path, then the circuit layout is simplified, but the circuit may be damaged during cutting

Engineering Contradiction:
Improvecircuit layout complexityVSAvoidcircuit survival rate
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent applies segmentation by dividing the circuit system into primary auxiliary circuits and backup circuits. The backup circuits are positioned at specific distances from the cutting path, creating spatial segments that separate vulnerable and protected circuit regions while maintaining functional integration

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements local quality by creating different spatial zones with different circuit densities and protection levels. The peripheral area contains both auxiliary circuits near the cutting path and backup circuits at a safe distance, with each zone optimized for its specific function

Inventive Principle:
Principle #3Local quality

3Reliability

If the backup circuit is positioned far from the cutting path, then the circuit is protected from damage, but the distance increases connection complexity

Engineering Contradiction:
Improvecircuit protectionVSAvoidconnection complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies partial action by positioning backup circuits at a specific optimal distance range (125-300 microns) from the cutting path. This distance is sufficient to provide protection from cutting damage while being close enough to minimize connection complexity and maintain signal integrity

Inventive Principle:
Principle #16Partial or excessive action

Data Source

PatentUS10886302B1Device substrate
Publication Date: 2021.01.05 AU OPTRONICS CORP
  • US10886302B1 patent drawing
  • US10886302B1 patent drawing
  • US10886302B1 patent drawing

AI summary

A device substrate includes a substrate, a first output circuit, a first auxiliary circuit, and a first backup circuit. The substrate has an active area and a peripheral area located on at least one side of the active area. A cutting path overlaps the active area and the peripheral area. The first output circuit is located on the peripheral area. The first auxiliary circuit is located on the peripheral area. The first auxiliary circuit overlaps the cutting path. The first backup circuit is located on the peripheral area and is electrically connected with the first auxiliary circuit. The first auxiliary circuit and the first backup circuit are pull-down circuits or are pull-up circuits. The shortest distance between the first backup circuit and the cutting path is from 125 microns to 300 microns.