Bezel Minimization via Backward Diode Packaging Film
Solution Overview
Problem
Conventional display devices with molding frames have a large bezel area, leading to reduced image size, increased assembly time, and light leakage issues due to poor sealability, which affects performance and increases costs.
Innovation Solution
A display device design featuring a packaging film with specific regions and properties that minimizes the bezel area by adhering the display panel and backward diode without a molding frame, using a pressure-sensitive adhesive layer and a packaging film with in-plane retardation of 30 nm or less, and a thickness-direction retardation of 35 nm or less, to enhance handling and assembly efficiency and prevent light leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a molding frame is used to assemble the backlight unit and LCD panel, then the structural stability is improved, but the bezel area increases and assembly time is extended
Solution Approach 1:
The patent removes the molding frame from the assembly structure, extracting the problematic component that caused both large bezel area and assembly time issues. The backlight unit and LCD panel are directly bonded without the intermediate molding frame structure.
Solution Approach 2:
The patent merges the backlight unit and LCD panel into a single integrated structure by directly bonding them together. This eliminates the separate molding frame assembly step and reduces the overall bezel area while maintaining structural integrity.
2Stability of the object's composition
If a molding frame is used to assemble the backlight unit and LCD panel, then the structural stability is improved, but the bezel area increases
Solution Approach 1:
The molding frame is extracted from the assembly, removing the source of the large bezel area. The direct bonding approach allows the display area to extend closer to the edges of the panel.
Solution Approach 2:
By merging the backlight unit and LCD panel into a single bonded structure, the bezel area is minimized. The components are positioned and bonded directly, eliminating the frame that previously created excessive bezel space.
3Stability of the object's composition
If optical members are inserted and fixed to the molding frame, then the assembly is secured, but the optical members may be damaged and sealability decreases
Solution Approach 1:
The molding frame is removed from the assembly process, eliminating the insertion and fixing steps that caused damage to optical members and poor sealability. The direct bonding method avoids these problematic operations entirely.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a bezel-free display device with improved assembly efficiency, reduced damage during handling, and enhanced sealability, thereby increasing yield and performance while minimizing costs.
Implementation Method 1
The packaging film includes a first region corresponding to a top surface of the backward diode, and a second region extending from the first region and corresponding to a side surface of the backward diode
Implementation Method 2
The packaging film has an in-plane retardation (Rin) of 30 nm or less, and a thickness-direction retardation (Rth) of 35 nm or less
Implementation Method 3
a pressure-sensitive adhesive layer formed between the display panel and the packaging film
Data Source
AI summary
Provided are a display panel, a backward diode equipped on a bottom surface of the display panel, a packaging film for packaging the backward diode, and a pressure-sensitive adhesive layer formed between the display panel and the packaging film. The packaging film includes a first region corresponding to a top surface of the backward diode, and a second region extending from the first region and corresponding to a side surface of the backward diode. Due to the display device, a bezel region can be minimized.