Baffle Buffer Apparatus for Bubble-Free Liquid Deposition

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Solution Overview

Problem

High flow rates of liquid materials into buffer apparatuses in semiconductor processes generate excessive bubbles, leading to non-uniform thin film deposition thickness, increased production costs, and reduced throughput due to the need for additional deposition processes to consume these bubbles.

Innovation Solution

A buffer apparatus with a baffle located under the input hole of a container, which changes the flow direction and reduces the flow rate of the liquid material, thereby minimizing bubble generation and transport into deposition machines, connected between the liquid material supply apparatus and the deposition machine.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If liquid material is filled at high flow rate into the buffer apparatus, then the filling efficiency is improved, but excessive bubbles are generated causing non-uniform thin film deposition

Engineering Contradiction:

Improvefilling efficiencyVSAvoidthin film deposition uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The baffle acts as an intermediary element between the input hole and the liquid material pool. It mediates the high-velocity liquid flow by providing a barrier that redirects the flow path, allowing the liquid to fill the buffer apparatus efficiently while preventing direct high-speed impact that generates bubbles, thus maintaining both filling efficiency and deposition uniformity

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The baffle introduces a spatial dimension change in the liquid flow path. By positioning the baffle laterally within the buffer apparatus, it forces the liquid to change direction from a direct vertical path into a redirected path along the baffle surface, reducing impact velocity and bubble generation while maintaining filling efficiency

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If undercoat, precoat, and dummy deposition processes are performed to consume bubbles, then the thin film deposition uniformity is improved, but the production time increases and throughput decreases

Engineering Contradiction:

Improvethin film deposition uniformityVSAvoidthroughput

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The baffle performs preliminary action by preventing bubble generation at the source during liquid material filling. This preliminary prevention eliminates the need for subsequent corrective actions (undercoat, precoat, dummy deposition), thereby maintaining deposition uniformity while avoiding the time loss and throughput reduction associated with these additional processes

Inventive Principle:

Principle #10Preliminary action

3Manufacturing precision

If undercoat, precoat, and dummy deposition processes are performed to consume bubbles, then the thin film deposition uniformity is improved, but the liquid material consumption increases and production cost rises

Engineering Contradiction:

Improvethin film deposition uniformityVSAvoidliquid material consumption

Core Design Contradiction:

Manufacturing precisionVSLoss of substance

Solution Approach 1:

The baffle converts the potentially harmful high-velocity liquid flow into a beneficial low-impact flow pattern. By redirecting the liquid flow along its surface, it transforms the high kinetic energy that would create bubbles into a gentle filling process, preventing bubble generation and eliminating the need to consume additional liquid material for corrective deposition processes

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces bubble transport into deposition machines, lowering production costs and improving throughput by minimizing the consumption of liquid materials and shortening undercoating and precoating times.

Implementation Method 1

the baffle is disposed under the input hole... a flow direction of the liquid material is changed

Methodology Applied

Scientific EffectFlow direction change:

Implementation Method 2

the flow rate of the liquid material is reduced to reduce bubbles generated

Methodology Applied

Scientific EffectFlow rate reduction:

Data Source

PatentUS8328938B2Buffer apparatus and thin film deposition system

Publication Date: 2012.12.11 UNITED MICROELECTRONICS CORP

AI summary

A buffer apparatus and a thin film deposition system are provided. The buffer apparatus is connected between a liquid material supply apparatus and a deposition machine. The buffer apparatus includes a container and a baffle. The container is used for containing a liquid material supplied from the liquid material supply apparatus. The top of the container has an input hole and an output hole. The baffle is disposed in the container and located under the input hole.