Plastic Bag Thermal Bonding with Mold Adhesion Strips

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Solution Overview

Problem

Existing thermal bonding methods for plastic bags face challenges in achieving hermetic sealing while preventing bag rupture and ensuring adhesive strength that asymptotically approaches the breaking force of the material, often resulting in pinhole formation and edge breakage due to uneven heat distribution and excessive sealant overflow.

Innovation Solution

A thermal bonding method using a heat bar with a microscopic semi-circular or trapezoidal protrusion to inject melted sealants along the edge, forming a mold adhesion strip, which suppresses sealant overflow and enhances cohesive adhesion, thereby preventing bag rupture and achieving strong adhesive strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If thermal bonding is performed using conventional heat bars with flat surfaces, then hermetic sealing can be achieved, but sealant overflow occurs and adhesive strength does not approach the breaking force of the material

Engineering Contradiction:
Improveadhesive strengthVSAvoidsealant overflow
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The heat bar surface is designed with localized microscopic protrusions (semi-circular or trapezoidal) instead of a flat surface. These protrusions create concentrated heating zones that melt sealant only at specific locations, allowing controlled injection along the seal line while preventing widespread overflow. This local quality change transforms the uniform heating approach into a targeted heating strategy.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The heat bar surface is segmented into multiple microscopic protrusions distributed along the sealing line. Each protrusion acts as an independent heat source that melts and injects sealant locally. This segmentation prevents the formation of a continuous overflow pool while ensuring adequate sealant distribution along the entire seal line.

Inventive Principle:
Principle #1Segmentation

2Strength

If heating temperature is increased to achieve cohesive adhesion and high adhesive strength, then adhesive strength approaches breaking force of material, but pinhole formation and edge breakage occur

Engineering Contradiction:
Improveadhesive strengthVSAvoidpinhole formation and edge breakage
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The protrusions create localized high-temperature zones exactly where sealant melting and injection are needed, while the surrounding areas remain at lower temperatures. This temperature gradient allows cohesive adhesion at the seal line without excessive heating that would cause pinholes and edge breakage in the bulk material.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The microscopic protrusions act as intermediaries that concentrate thermal energy precisely at the seal line. They mediate between the heat source and the sealant, delivering the necessary heat for cohesive adhesion only where required, thereby preventing harmful thermal effects in other areas.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If uniform heating is applied across the entire bonding surface, then heating is simple and efficient, but heat distribution is uneven leading to poor bonding quality

Engineering Contradiction:
Improveheating efficiencyVSAvoidbonding quality uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

Instead of uniform heating, the system applies localized heating through protrusions at specific intervals along the seal line. This non-uniform heating pattern is precisely what is needed to melt sealant at discrete locations for injection, achieving both efficient heating and uniform bonding quality along the entire seal.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The heating pattern transitions from static uniform heating to a dynamic pattern where heat is concentrated at moving or discrete points (the protrusions). This dynamic heating approach better matches the requirements of the sealing process, where localized melt and injection are more effective than uniform heating.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively prevents bag rupture and ensures hermetic sealing with adhesive strength approaching the material's breaking force, reducing plastic material usage and improving resistance to dynamic impacts.

Implementation Method 1

pressure-bonds and heats outer surfaces of a material

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the sealant that has been melted at a temperature within a temperature zone for cohesive adhesion

Methodology Applied
Scientific EffectMelting: Melting

Data Source

PatentEP4691924A1Thermal bonding method for plastic bag and method for producing plastic bag
Publication Date: 2026.02.11 HISHINUMA KAZUO
  • EP4691924A1 patent drawingFigure 1~2
  • EP4691924A1 patent drawingFigure 3
  • EP4691924A1 patent drawingFigure 4~5

AI summary

Provided is a thermal bonding method for a plastic bag, comprising: heat-sealing a heat sealing material interposed between a pair of heating bodies, wherein one of the pair of heating bodies has a microscopic linear protrusion having a semi-circular or trapezoidal sectional shape, and wherein the heated linear protrusion is pressed against a sealant of the heat sealing material to inject the sealant that has been melted at a temperature within a temperature zone for cohesive adhesion in a strip-like shape along a side edge of the linear protrusion so as to form a mold adhesion strip.