Bake Unit Vacuum Plate Layout for Uniform Substrate Heating
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Solution Overview
Problem
Existing thermal processing apparatuses face challenges in uniformly applying heat to substrates due to warpage, which increases deformation under high vacuum pressures, affecting temperature distribution during semiconductor manufacturing.
Innovation Solution
A thermal processing apparatus with a disc-shaped base plate, support pins, vacuum holes, and protruding members that apply a low vacuum pressure to minimize substrate deformation, ensuring uniform heat application through increased air flow resistance and controlled vacuum pressures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If large vacuum pressure is applied to adhere the substrate to the support plate, then adhesion is improved, but substrate deformation increases which adversely affects temperature distribution
Solution Approach 1:
The base plate is divided into multiple vacuum holes distributed across its surface, allowing vacuum pressure to be applied at multiple discrete locations rather than uniformly across the entire substrate. This segmentation enables effective adhesion while reducing the overall vacuum pressure magnitude needed, thereby minimizing substrate deformation.
Solution Approach 2:
Vacuum holes are positioned at specific locations corresponding to areas requiring stable support, particularly near the periphery where substrate warpage typically occurs. This localized vacuum application provides targeted adhesion strength where needed most, while avoiding excessive vacuum pressure across the entire substrate that would cause deformation.
2Stability of the object's composition
If vacuum pressure is applied to hold the substrate, then substrate stability is improved, but substrate deformation increases under high vacuum pressure
Solution Approach 1:
Multiple vacuum holes are distributed across the base plate to provide stable substrate holding through localized vacuum zones. This segmentation allows the substrate to be held stable at key positions without subjecting the entire substrate to high vacuum pressure that would cause warpage.
Solution Approach 2:
The vacuum holes act as intermediary points between the base plate and substrate, providing stable adhesion through discrete vacuum zones. This intermediary approach allows effective substrate holding while distributing the vacuum pressure effects to minimize overall substrate deformation.
3Reliability
If high vacuum pressure is used for substrate adhesion, then adhesion is ensured, but temperature distribution uniformity deteriorates due to substrate deformation
Solution Approach 1:
The vacuum system is segmented into multiple holes rather than a single large vacuum zone. This allows reliable adhesion through distributed vacuum points while maintaining substrate flatness, ensuring uniform thermal contact between the substrate and base plate for even temperature distribution.
Solution Approach 2:
Vacuum holes are strategically positioned at locations where adhesion is most critical, providing reliable holding without applying high vacuum pressure across the entire substrate surface. This localized approach maintains substrate flatness and ensures uniform thermal contact with the base plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively minimizes substrate deformation and ensures uniform heat distribution across the entire substrate area using low vacuum pressure, maintaining substrate stability during thermal processing.
Implementation Method 1
applying a vacuum pressure to the vacuum hole, thereby bringing the substrate into close contact with the base plate
Implementation Method 2
heat may be applied to the substrate through a hot wire provided on a lower surface of the base plate
Data Source
AI summary
Proposed is a thermal processing apparatus, an operation method thereof, and photo spinner equipment having a bake unit as the thermal processing apparatus, capable of uniformly applying heat to the entire area of a substrate by minimizing defamation of the substrate using low vacuum pressure. The thermal processing apparatus includes the base plate provided in a disc shape, a support pin provided on an upper surface of the base plate, a vacuum hole formed through the base plate, and a protruding member provided at a height lower than that of the support pin on the upper surface of the base plate.