Baking equipment for use in display panel manufacturing process
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Solution Overview
Problem
Existing baking equipment for TFT array substrates in display panel manufacturing experiences unstable baking processes due to uneven heating temperatures, caused by differences in heating efficiency and temperature measurement accuracy between heaters and sensors.
Innovation Solution
The proposed baking equipment features a liquid passing system with spirally wound first and second pipes inside the baking plate, a circulation pump, temperature sensors, and a heater to ensure uniform heating by controlling the flow speed of the heating liquid and maintaining preset temperature thresholds, along with a cooling system to prevent heat loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If zone temperature-controlled baking with multiple heaters and sensors is used, then the baking equipment can cover large area, but the temperature uniformity deteriorates due to heating efficiency differences and measurement accuracy variations
Solution Approach 1:
The patent uses a liquid circulation system with pipes embedded in the baking plate to replace traditional electric heaters and sensors. Heating liquid flows through the pipes to provide uniform thermal energy distribution across the baking plate, eliminating the temperature non-uniformity caused by variations in heater efficiency and sensor accuracy while maintaining large baking area capability
2Device complexity
If traditional heater and sensor system is used, then the structure is simple, but the baking process stability deteriorates due to temperature non-uniformity
Solution Approach 1:
The patent implements a liquid circulation heating system where heating liquid flows through pipes embedded in the baking plate. This system provides superior temperature uniformity and baking process stability compared to traditional heater-sensor systems, while the added complexity of the circulation system is justified by the significant improvement in reliability
Solution Approach 2:
The patent changes the physical state and mode of heat transfer from electric heating (Joule heating) to liquid-phase convective heat transfer. By circulating heating liquid through pipes in the baking plate, the system achieves more uniform temperature distribution and better process stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures a stable and uniform baking temperature for TFT array substrates, improving the consistency and reliability of the baking process by maintaining temperature uniformity and reducing heat loss.
Implementation Method 1
the heating liquid is configured to uniformly heat the baking plate during flowing through the passage
Implementation Method 2
the circulation pump is configured to circulate the heating liquid in a passage constituted by the third pipe, the first pipe, the second pipe, the fourth pipe, and the circulation pump
Implementation Method 3
the first temperature sensor is disposed on an outer surface of the third pipe and is configured to monitor a temperature of the heating liquid injected into the first pipe; the second temperature sensor is disposed on an outer surface of the fourth pipe and is configured to monitor a temperature of the heating liquid discharged from the second pipe
Implementation Method 4
a heater configured to heat the heating liquid when the temperature monitored by the first temperature sensor is less than a first preset threshold or when the temperature monitored by the second temperature sensor is less than a second preset threshold
Data Source
AI summary
The present application provides a baking equipment applied in a display panel manufacturing process. In the present application, the first and second pipes are communicated with each other and evenly distributed inside the baking plate, so that the heating liquid injected from the head end of the first pipe heats the baking plate evenly during flowing through the first and second pipes, which improves the uniformity of the baking temperature of the TFT array substrate to be baked by the baking plate, thereby ensuring the stability of the baking process of the TFT array substrate.