Ball Mount Cleaning Nozzle Layout to Limit Spray Overlap
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Solution Overview
Problem
Current semiconductor package cleaning processes often result in incomplete removal of flux residue and contaminants, leading to defects such as water marks and trapped cleaning fluid, which can affect the reliability and performance of semiconductor devices.
Innovation Solution
A system comprising a sprayer device with strategically positioned nozzles to ensure uniform distribution of pressurized cleaning fluid, combined with a conveyor system and a dryer using a jet air knife for efficient removal of cleaning fluid and drying of semiconductor package assemblies, reducing overlap between spray patterns and enhancing cleaning efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional cleaning process is used, then the process is simple, but the cleaning is incomplete and defects remain
Solution Approach 1:
The cleaning system is segmented into multiple functional zones: a spray zone with multiple nozzles for contaminant removal, a transition zone, and a drying zone with a dryer. This segmentation allows each zone to perform its specific function optimally, achieving complete cleaning while maintaining manageable system complexity through modular design.
Solution Approach 2:
The patent introduces a spatial dimension to the cleaning process by arranging nozzles at different positions and angles to create overlapping spray patterns that cover the entire semiconductor package surface. The conveyor system adds temporal dimension by moving packages through the cleaning zone, ensuring comprehensive coverage without requiring excessively complex multi-stage processing.
2Manufacturing precision
If multiple nozzles are used to improve cleaning coverage, then cleaning uniformity improves, but spray pattern overlap increases and efficiency decreases
Solution Approach 1:
Each nozzle is positioned and angled to target specific regions of the semiconductor package, creating locally optimized spray patterns. The nozzles are arranged so that their spray patterns overlap just enough to ensure uniform coverage without excessive redundancy, achieving cleaning uniformity while maintaining efficiency.
Solution Approach 2:
The spray patterns are designed to have partial overlap rather than complete coverage redundancy. This partial overlap ensures that all areas receive adequate cleaning attention while avoiding the waste associated with excessive spray coverage, thereby balancing cleaning uniformity with processing efficiency.
3Manufacturing precision
If cleaning fluid is applied thoroughly, then contaminant removal improves, but trapped fluid and water marks increase
Solution Approach 1:
The drying zone with the dryer is positioned immediately after the spray zone in the conveyor path, providing preliminary drying action before packages exit the cleaning system. This preliminary drying prevents trapped fluid from evaporating unevenly and forming water marks, while the thorough spraying ensures complete contaminant removal.
Solution Approach 2:
The system maintains continuous action by having the conveyor move packages continuously through the spray zone and immediately into the drying zone. This continuous flow ensures that cleaning and drying occur in seamless succession, preventing fluid trapping while maintaining efficient contaminant removal without interruption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved cleaning efficiency by ensuring thorough removal of contaminants and drying, reducing defects and enhancing the reliability of semiconductor packages.
Implementation Method 1
a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly
Implementation Method 2
a dryer spatially displaced from the sprayer device along the first direction and configured to direct a pressurized gas flow at the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device
Data Source
AI summary
An embodiment system, configured to clean a semiconductor package assembly, may include a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly; a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction; and a dryer spatially displaced from the sprayer device and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device. Each of the plurality of nozzles may be displaced from one another along a second direction to thereby generate respective separate spray distribution patterns. Adjacent nozzles may be further displaced from one another along a third direction to thereby a reduce an overlap of adjacent spray distribution patterns relative to a configuration in which the adjacent nozzles are not displaced from one another along the third direction.