Ball Mounting Apparatus Rotary Substrate Translation
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Solution Overview
Problem
Current solder ball placement processes in ball grid arrays face inefficiencies due to the need for double fiducial vision checks, flux contamination issues from syringe remnants, and high manufacturing costs from precise gap maintenance requirements for accurate solder ball distribution.
Innovation Solution
A method and device that laterally translate and rotate a substrate for flux and solder ball application, utilizing a rotary conveyor assembly and fluid interface for precise solder ball distribution, and a dual-pressure system to prevent flux contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If flux and ball mounting regions are placed in series, then fiducial vision can be taken separately at each platform, but the process speed is reduced due to double inspection requirements
Solution Approach 1:
The patent combines the flux deposition head and ball pick head onto a single platform, allowing both operations to share a common fiducial vision system. This eliminates the need for separate vision checks at different platforms while maintaining placement precision, thereby resolving the contradiction between measurement accuracy and process speed.
Solution Approach 2:
The single platform is designed to perform multiple functions: flux deposition, ball picking, and ball placement, all under one fiducial vision system. This multi-functional approach allows the system to maintain high precision through a unified vision reference while improving productivity by eliminating redundant inspection steps.
2Productivity
If flux and ball mounting regions are placed parallel, then process speed improves by taking fiducial vision once, but machine cycle time increases due to idle time at single platform
Solution Approach 1:
The patent enables continuous operation by allowing the flux deposition head and ball pick head to operate sequentially on the same platform without idle time. While one head is performing an operation, the other can be prepared or positioned, ensuring that the single platform is continuously productive and eliminating wasted machine cycle time.
Solution Approach 2:
The system employs periodic alternating operations between the flux deposition head and ball pick head on the single platform. This rhythmic sequencing of operations ensures that both functions are performed efficiently without creating idle time, as one head operates while the other resets or prepares for the next cycle.
3Quantity of substance
If syringe is used to inject flux into flux pool, then flux supply is maintained, but flux contamination occurs from syringe remnants
Solution Approach 1:
The patent extracts the syringe from the flux delivery system and replaces it with a direct pump-to-flux-pool connection. This elimination of the syringe intermediate component removes the source of flux contamination from syringe remnants while maintaining continuous flux supply to the flux pool.
Solution Approach 2:
The patent introduces a pump as an intermediary device between the flux container and flux pool, replacing the syringe mechanism. This new intermediary provides clean flux delivery without the contamination issues associated with syringe plungers and seals, while maintaining precise control over flux supply quantity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces bottlenecks in the ball mounting process, minimizes flux contamination, and lowers manufacturing costs by simplifying the precision requirements for gap maintenance, enhancing the efficiency and accuracy of solder ball placement.
Implementation Method 1
a fluid interface device for providing a fluid interface between the template and reservoir housing
Implementation Method 2
A method and device that laterally translate and rotate a substrate for flux and solder ball application
Implementation Method 3
a dual-pressure system to prevent flux contamination
Data Source
AI summary
A device for mounting an array of solder balls to a plurality of substrates of integrated circuits, comprising: a first plate for receiving a first substrate in a loading position; said first plate adapted to translate laterally from a substrate loading position to a flux receiving position; said first plate further adapted to rotate 180° from the substrate loading position to a such that the first plate is in a solder ball receiving position, and; mounting solder balls to the first plate.