Conductive Ball Mounting Apparatus with Support Plate
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Solution Overview
Problem
The challenge lies in effectively mounting small-sized conductive balls on a substrate without defects, such as missing or misplaced balls, due to the deformation of thin masks and the resulting gaps between the mask and substrate, which increases the likelihood of process defects during high-density semiconductor device assembly.
Innovation Solution
An apparatus comprising a mask with mounting holes, a support plate to prevent mask deformation, a mounting unit for precise placement of conductive balls, a holding unit to maintain balls in place, and a transporting unit for efficient substrate alignment, along with a controller to coordinate operations, ensures accurate and rapid mounting of conductive balls by preventing mask bending and maintaining a stable substrate position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a thin mask is used to match the small size of conductive balls, then the mounting precision for small-sized conductive balls is improved, but the mask deformation increases causing gaps between mask and substrate
Solution Approach 1:
The support structure is divided into multiple segments (support plates positioned at different locations) to provide distributed support to the mask, preventing deformation while maintaining the thin mask structure needed for precise mounting of small conductive balls
Solution Approach 2:
Support plates are introduced as intermediary elements between the mask and the mounting apparatus. These plates provide mechanical support to prevent mask deformation and bending, thereby preventing gap formation between the mask and substrate while allowing the mask to maintain its thin profile for precise alignment
2Productivity
If the number of conductive balls to be mounted is increased for high-density assembly, then the productivity is improved, but the possibility of defects increases
Solution Approach 1:
The apparatus incorporates detection means to monitor the mounting process in real-time, providing feedback on the position and status of each conductive ball. This enables immediate detection and correction of potential defects, ensuring high reliability even when mounting large numbers of balls for high-density assembly
Solution Approach 2:
The apparatus replaces manual or simple mechanical mounting methods with an automated mounting apparatus that can precisely and rapidly position multiple conductive balls. This automation ensures consistent positioning accuracy and reduces human error, maintaining low defect rates while achieving high productivity
3Manufacturing precision
If a thin mask is used, then the mounting precision for small conductive balls is improved, but the time for mounting conductive balls increases
Solution Approach 1:
The support plates are positioned and the mask is stabilized before the mounting process begins. This preliminary support prevents mask deformation during ball placement, eliminating the need for time-consuming adjustments or repositioning, thus maintaining both high precision and efficient mounting speed
Data Source
AI summary
Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.