Banded Graph Cut Segmentation for Thin Structures

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Solution Overview

Problem

Current image segmentation techniques, such as Graph Cuts, face significant computational burdens when processing large high-resolution images or medical volumes, leading to slow processing times, especially when attempting to segment thin structures like blood vessels.

Innovation Solution

A modified multilevel banded graph cut method that uses a difference image to identify and include thin structures during the segmentation process, employing a Laplacian pyramid to recover lost information and extend the segmentation band, thereby improving computational efficiency while maintaining accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional Graph Cuts algorithm is used for image segmentation, then segmentation accuracy is maintained, but computational time and processing speed deteriorate significantly for large high-resolution images

Engineering Contradiction:
Improvesegmentation accuracyVSAvoidcomputational time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The image segmentation process is divided into multiple resolution levels. The algorithm first segments the image at a coarse resolution level, then progressively refines the segmentation at finer resolution levels. This multi-level segmentation approach reduces the computational burden at each level while maintaining overall segmentation accuracy, directly addressing the contradiction between segmentation accuracy and computational time.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a resolution level dimension to the segmentation process. By adding this temporal/spatial dimension, the algorithm can perform computations at different scales, starting from coarse to fine. This dimensional approach allows the system to achieve accurate segmentation without being constrained by the computational limitations of processing full-resolution images directly, thus resolving the time-accuracy tradeoff.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If image coarsening is applied to reduce computational burden, then processing speed improves, but thin structures like blood vessels are lost or degraded

Engineering Contradiction:
Improveprocessing speedVSAvoidthin structure information
Core Design Contradiction:
ProductivityVSLoss of information

Solution Approach 1:

The algorithm performs preliminary segmentation at coarse resolution levels to establish an initial segmentation framework. This preliminary action captures the general structure and boundaries, while thin structures are preserved through the progressive refinement process in subsequent finer resolution levels, preventing information loss while maintaining processing efficiency.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies different processing qualities at different resolution levels. Coarse levels provide overall structural context with lower computational requirements, while fine levels provide detailed local information including thin structures. This local quality differentiation ensures that thin structures are preserved in the final refinement stages without compromising the overall processing speed achieved through coarser preliminary levels.

Inventive Principle:
Principle #3Local quality

3Productivity

If multilevel banded graph cut method is used, then computational efficiency improves, but accuracy in segmenting thin structures may deteriorate without Laplacian pyramid enhancement

Engineering Contradiction:
Improvecomputational efficiencyVSAvoidsegmentation accuracy of thin structures
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The Laplacian pyramid acts as an intermediary mechanism that bridges the coarse and fine resolution levels. It captures the difference information between successive resolution levels, allowing the algorithm to identify and preserve thin structures that would otherwise be lost during coarsening. This intermediary approach maintains computational efficiency while restoring accuracy for thin structure segmentation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent dynamically adjusts the band width parameter at different resolution levels based on the Laplacian pyramid analysis. By changing this parameter adaptively, the algorithm can expand the band in regions where thin structures are detected (through Laplacian analysis) while maintaining computational efficiency in other regions, thus resolving the contradiction between efficiency and accuracy for thin structures.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS7822274B2Banded graph cut segmentation algorithms with laplacian pyramids
Publication Date: 2010.10.26 JOLLY SEVEN SERIES 70 OF ALLIED SECURITY TRUST I
  • US7822274B2 patent drawing
  • US7822274B2 patent drawing
  • US7822274B2 patent drawing

AI summary

A process for segmenting an object of interest from background, comprising: obtaining a master, high-resolution image of an object disposed within a background; applying a first band graph cut process to the master image generating a second image with the object being segmented from the background to a first approximation; and, comparing the second image with the master image to produce a comparison image with pixels identified by the comparison to be background images being removed from the comparison image.