Bandgap Voltage Reference Generator Without Trimming Circuitry

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Solution Overview

Problem

Conventional thermal sensing circuits using bandgap voltage reference circuits require elaborate trimming or programming for calibration and consume valuable chip layout space, and often necessitate a separate thermal sensing element, limiting flexibility and efficiency.

Innovation Solution

The implementation of bandgap voltage reference generators that do not rely on trimming circuitry, allowing for multiple reference voltages to be generated without consuming excessive layout space, and eliminating the need for a separate thermal sensing element by using a single bandgap reference circuit to adjust thermal thresholds dynamically.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If conventional bandgap voltage reference circuits are used to provide stable reference voltages, then temperature insensitivity is achieved, but elaborate trimming circuitry and programming are required for calibration

Engineering Contradiction:
Improvereference voltage stabilityVSAvoidtrimming circuitry complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the trimming circuitry from the bandgap voltage reference circuit. By using a single bandgap reference circuit to generate multiple reference voltages through resistive dividers, the invention removes the need for elaborate trimming and programming components while maintaining calibration accuracy.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The single bandgap reference circuit serves multiple functions by generating multiple reference voltages (Vref1, Vref2, Vref3) simultaneously through resistive divider networks. This multi-functional approach eliminates the need for separate trimming circuits for each reference voltage, reducing overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple reference voltages are generated using conventional methods, then thermal thresholds can be adjusted, but valuable chip layout space is consumed

Engineering Contradiction:
Improvethermal threshold adjustabilityVSAvoidchip layout space
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent merges the generation of multiple reference voltages into a single integrated bandgap reference circuit with shared resistive divider networks. This consolidation allows multiple thermal thresholds to be implemented without proportionally increasing chip area, as the same physical components serve multiple reference voltage generation functions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The bandgap reference circuit is designed to universally generate multiple reference voltages (Vref1, Vref2, Vref3) that correspond to different thermal thresholds. This universal generation capability provides thermal threshold adaptability without requiring separate dedicated circuits for each threshold level.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Measurement precision

If separate thermal sensing elements are used, then temperature monitoring accuracy is improved, but device complexity and chip space increase

Engineering Contradiction:
Improvetemperature monitoring accuracyVSAvoidsensing element quantity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The bandgap reference circuit performs dual functions: it generates stable reference voltages for threshold comparison and simultaneously serves as the thermal sensing element. The base-to-emitter voltage of the transistors within the bandgap circuit provides the temperature-dependent signal, eliminating the need for separate thermal sensing elements while maintaining measurement accuracy.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention merges the reference voltage generation function and the thermal sensing function into a single integrated circuit block. The same transistors and resistors that establish the bandgap reference voltage also provide the temperature-sensitive voltage signal, reducing device complexity and chip space requirements.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables thermal sensing circuits to operate at a fixed operating point with adjustable thermal thresholds, reducing the need for calibration and minimizing chip space usage, while providing multiple reference voltages without the need for additional sensing elements.

Implementation Method 1

Bandgap voltage reference circuits utilize the characteristics of the bandgap energy of a semiconductor material to provide a stable reference voltage. The bandgap energy of a semiconductor material is typically a physical constant at zero degrees Kelvin.

Methodology Applied
Scientific EffectBandgap energy:

Implementation Method 2

As the temperature of the semiconductor material increases, the voltage across a forward biased PN junction will decrease at a rate which depends upon the cross-sectional area of the particular PN junction and the specific semiconductor material being used.

Methodology Applied
Scientific EffectNegative temperature coefficient:

Data Source

PatentUS7524108B2Thermal sensing circuits using bandgap voltage reference generators without trimming circuitry
Publication Date: 2009.04.28 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US7524108B2 patent drawing
  • US7524108B2 patent drawing
  • US7524108B2 patent drawing

AI summary

Methods, systems and thermal sensing apparatus are provided that use bandgap voltage reference generators that do not use trimming circuitry. Further, circuits, systems, and methods in accordance with the present invention are provided that do not use large amounts of chip real estate and do not require a separate thermal sensing element.