Bottom Antireflective Coating Composition for Etching Resistance
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Solution Overview
Problem
In semiconductor device manufacturing, existing bottom antireflective coatings fail to provide sufficient etching resistance, applicability, and gap filling properties, especially on complex substrates, and are affected by standing waves due to light reflection, which impacts the dimensional accuracy of photoresist patterns.
Innovation Solution
A bottom antireflective coating composition comprising a specific polymer with repeating units, a low molecular weight crosslinking agent, and a solvent, which forms a coating that reduces standing waves and enhances etching resistance and gap filling capabilities, even at lower baking temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional bottom antireflective coating is used, then the coating can be applied to the substrate, but the etching resistance is insufficient and the coating cannot withstand the etching process
Solution Approach 1:
The patent uses a copolymer composition combining polymer A (with specific repeating units containing fluorine and/or hydrogen atoms) and polymer B (with aromatic hydrocarbon rings), along with a crosslinking agent, to create a composite material that achieves both etching resistance and coating integrity. The composite structure allows the coating to withstand etching processes while maintaining its protective function.
2Temperature
If the baking temperature is reduced to a relatively low temperature, then the manufacturing process becomes simpler and energy consumption is reduced, but the crosslinking reaction is insufficient and the coating quality deteriorates
Solution Approach 1:
The patent changes the chemical parameters of the coating composition by selecting specific polymers with appropriate functional groups and a crosslinking agent that can effectively crosslink at low temperatures. This allows the crosslinking reaction to proceed sufficiently at reduced baking temperatures (80°C to 150°C), maintaining coating quality while simplifying the manufacturing process and reducing energy consumption.
3Adaptability or versatility
If the coating is applied to a stepped substrate, then the gap filling property is required, but the conventional coating cannot fill the gaps effectively and shows poor applicability
Solution Approach 1:
The patent applies the local quality principle by designing a coating composition with specific rheological properties and adhesion characteristics that enable it to adapt to different substrate topographies. The copolymer structure and crosslinking mechanism allow the coating to fill gaps in stepped substrates effectively while maintaining uniform thickness and proper adhesion, achieving both gap filling property and applicability on complex substrates.
4Manufacturing precision
If the absorbance to exposure radiation is increased, then the standing waves are reduced and dimensional accuracy is improved, but the coating may become too thick and affect the lithography resolution
Solution Approach 1:
The patent uses a composite material approach with a copolymer system that provides optimized optical properties. The specific combination of polymer A and polymer B, along with the crosslinking agent, creates a coating with appropriate absorbance to reduce standing waves and improve dimensional accuracy, while maintaining a controlled thickness that does not adversely affect lithography resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high etching resistance, improved applicability, and effective gap filling, while reducing standing waves and allowing sufficient crosslinking at lower temperatures, thus enhancing the accuracy and quality of photoresist patterns.
Implementation Method 1
even when baking temperature is reduced to a relatively low temperature, sufficient crosslinking reaction proceeds
Implementation Method 2
having large absorbance to the radiation used for the exposure of a photoresist
Data Source
AI summary
[Problem to be Solved] To provide a bottom antireflective coating forming composition which can show high etching resistance and can be crosslinked even at a relatively low temperature. Further, to provide a resist pattern manufacturing method and a device manufacturing method using the same. [Solution] The bottom antireflective coating forming composition comprises: a polymer A comprising specific repeating units; a low molecular crosslinking agent having a molecular weight of 100 to 3,000; and a solvent. The resist pattern manufacturing method and the device manufacturing method using the same are also provided.