Bare-Chip Mounted Wireless Sensor Module
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Solution Overview
Problem
Existing wireless communication devices for sensor networks are not compact enough to be unnoticeable when carried, and integrating semiconductor chips and antennas as package devices increases module size and production costs.
Innovation Solution
The solution involves mounting semiconductor chips and antennas as bare chips on separate wiring boards, eliminating the need for leads and package sizes, allowing for direct chip-to-board coupling, which reduces module size and production costs while enhancing versatility by separating data processing and wireless communication units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If integrated semiconductor packages are used in wireless sensor network nodes, then the nodes can be manufactured with standardized components, but the module size increases and production costs rise
Solution Approach 1:
The patent divides the wireless sensor node into separate functional modules: sensor module, data processing unit, and wireless communication unit. Each module uses bare-chip mounting instead of integrated packages, allowing independent optimization of size and manufacturing for each component while reducing overall node volume.
Solution Approach 2:
The patent transitions from planar integration to three-dimensional stacking by mounting multiple bare chips vertically on a single substrate. This dimensional change allows higher component density without increasing the footprint area, effectively reducing the overall node volume while maintaining standardized manufacturing processes.
2Reliability
If separate radio certifications are obtained for each sensor type, then the wireless communication reliability is ensured, but the production costs increase
Solution Approach 1:
The patent implements a universal wireless communication unit that can work with multiple sensor types through standardized interfaces and protocols. This single certified unit replaces the need for separate certifications for each sensor-communication combination, reducing production costs while maintaining reliability through consistent communication standards.
Solution Approach 2:
The patent uses standardized communication protocols and interface specifications that can be replicated across different sensor types. Once a wireless communication unit is certified for one sensor type, the same design can be copied and applied to other sensor types through standardized interfaces, eliminating the need for redundant certifications.
3Reliability
If additional amplifier circuits are included in the module, then the signal transmission quality is improved, but the power consumption increases and battery life decreases
Solution Approach 1:
The patent extracts the amplification function from separate amplifier circuits and integrates it directly into the bare-chip sensor and communication units. This eliminates the need for additional discrete amplifier components, reducing power consumption while maintaining signal quality through optimized on-chip amplification designed specifically for each function.
Solution Approach 2:
The patent merges the amplification function with the sensor and communication chips themselves, combining multiple functions (sensing, amplification, processing, and transmission) into single integrated components. This reduces the total number of components and interconnections, lowering power consumption while maintaining or improving signal transmission quality through reduced signal path losses.
Data Source
AI summary
A compact electronic device as a constituent element of a wireless communication system using a sensor. A first feature of the device is that a first semiconductor chip is bare-chip-mounted over a front surface of a first wiring board in the form of a chip and a second semiconductor chip is bare-chip-mounted over a second wiring board in the form of a chip. A second feature is that a wireless communication unit and a data processing unit which configure a module are separately mounted. A third feature is that the first and second wiring boards are stacked in the board thickness direction to make up the module (electronic device).