Bare IC Chip Transparent Protection Layer for Display Space Reduction

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Solution Overview

Problem

Silicon-based integrated circuit elements occupy excessive space and use non-transparent materials for encapsulation, hindering the development of intelligent transparent displays.

Innovation Solution

An integrated circuit element is fabricated by directly placing a bare integrated circuit chip with connection points onto a base plate using microtransfer printing, omitting conventional encapsulation and utilizing a protection layer made of transparent materials to reduce space occupation and enable transparent displays.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional encapsulation is used for silicon-based integrated circuit elements, then the elements are protected and mechanically supported, but the space occupied increases significantly and transparency is lost

Engineering Contradiction:

Improveprotection and mechanical supportVSAvoidspace occupied by integrated circuit element

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent replaces conventional bulky encapsulation with a thin film protection layer formed by depositing transparent materials (such as transparent conductive oxides or organic transparent materials) directly onto the bare integrated circuit chip. This thin film provides the necessary protection and mechanical support while occupying minimal space and maintaining transparency, thereby resolving the contradiction between protection and space occupation.

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If conventional encapsulation is used for silicon-based integrated circuit elements, then the elements are protected and mechanically supported, but transparency is lost which hinders intelligent transparent display

Engineering Contradiction:

Improveprotection and mechanical supportVSAvoidtransparency

Core Design Contradiction:

ReliabilityVSIllumination intensity

Solution Approach 1:

The patent employs thin film protection layers made from transparent materials that allow light to pass through while providing necessary protection. This resolves the contradiction between providing reliable protection and maintaining transparency for intelligent transparent display applications.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent utilizes transparent materials with specific optical properties that allow the protection layer to be visually transparent while still providing mechanical and environmental protection. This enables the integrated circuit elements to be incorporated into transparent displays without compromising either protection or transparency.

Inventive Principle:

Principle #32Color changes

3Reliability

If conventional encapsulation process is used, then the integrated circuit elements are protected, but the manufacturing cost increases significantly accounting for 70-80% of total sensor cost

Engineering Contradiction:

ImproveprotectionVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the complex and costly conventional encapsulation process with a simplified thin film deposition process. By depositing transparent protective layers directly onto the bare chips, the manufacturing process becomes more efficient and cost-effective, reducing the protection-related cost from 70-80% of total sensor cost to a much lower proportion while maintaining adequate protection.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS10340145B2Integrated circuit element and fabricating method thereof, circuit board, display panel and display device

Publication Date: 2019.07.02 BOE TECHNOLOGY GROUP CO LTD

AI summary

An integrated circuit element and a fabrication method thereof, a circuit board, a display panel and a display device are provided, to reduce space occupied by the integrated circuit element and facilitate achieving intelligent transparent display by arranging the integrated circuit element in a display. The integrated circuit element includes a base plate, and a bare integrated circuit chip and multiple connection parts arranged on the base plate. The bare integrated circuit chip includes multiple connection points that are respectively electrically connected to the multiple connection parts.