Bare-Die Bridge With Copper Pillars for Thin SiP Interconnects
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Solution Overview
Problem
Package miniaturization in electronic devices poses challenges in integrating active and passive components while ensuring physical protection and effective heat management.
Innovation Solution
A system-in-package configuration using a bare die semiconductive bridge connected with copper pillars, encapsulated in a molding compound, facilitates interconnects between devices, providing protection and heat management through a semiconductive bridge and interconnect packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package miniaturization is implemented, then device integration density is improved, but physical protection and heat management become more difficult
Solution Approach 1:
The patent combines multiple functions into the interconnect structure itself. The copper pillars serve simultaneously as electrical interconnects, mechanical support elements, and thermal conduction paths. The molding compound encapsulates both the bare-die semiconductive bridge and interconnect packages, providing unified physical protection. This merging allows miniaturization while maintaining protection and heat management through multi-functional integration rather than separate dedicated structures.
Solution Approach 2:
The interconnect pillars are designed with universal functionality, serving as electrical conductors, mechanical anchors, and thermal pathways all at once. The bare-die semiconductive bridge provides both electrical connection and structural bridging between interconnect packages. The molding compound provides universal protection for all components within the miniaturized package. This multi-functionality resolves the contradiction by eliminating the need for additional dedicated protection and heat management structures that would increase package size.
2Length of stationary object
If thin-profile apparatus are used, then package height is reduced, but interconnection reliability becomes more challenging
Solution Approach 1:
The patent transitions from vertical stacking to a more planar, lateral arrangement of interconnect pillars and bare-die semiconductive bridge. The copper pillars extend laterally rather than vertically, and the semiconductive bridge spans horizontally between interconnect packages. This dimensional change allows reduced package height while maintaining adequate interconnection lengths and angles for reliable electrical and mechanical coupling.
Solution Approach 2:
The patent changes key geometric parameters of the interconnect structure. The copper pillars are configured with specific lengths, diameters, and angles optimized for thin-profile applications. The bare-die semiconductive bridge uses controlled thickness and lateral dimensions. These parameter changes enable the interconnections to function reliably within the constrained height of a thin-profile package by optimizing the geometry for the specific application rather than using conventional vertical configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reduced package height and improved thermal and electrical connectivity, supporting miniaturization without compromising performance.
Implementation Method 1
improved thermal and electrical connectivity
Implementation Method 2
improved thermal and electrical connectivity
Data Source
AI summary
A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor.