Bare-Die Smart Bridge With Copper Pillars for Thin SiP Packaging
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Solution Overview
Problem
Package miniaturization in electronic devices poses challenges in integrating active and passive components while ensuring physical protection and effective heat management.
Innovation Solution
A system-in-package configuration using a bare die semiconductive bridge connected with copper pillars, encapsulated in a molding compound, facilitates interconnects between devices, providing a smart connector for processors and memory dies, with optional redistribution layers and through-silicon vias for enhanced communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package miniaturization is implemented to reduce device size, then the overall package dimensions are reduced, but physical protection and heat management become more difficult
Solution Approach 1:
The patent combines multiple functions into the interconnect structure itself. The copper pillars serve both as electrical interconnects and as thermal management conduits, while the molding compound provides both mechanical protection and thermal pathways. This integration allows miniaturization without sacrificing protection or heat management capabilities.
Solution Approach 2:
The interconnect package acts as an intermediary structure between the bare die semiconductive bridge and the external environment. It provides physical protection through the molding compound while incorporating thermal management features, and facilitates heat dissipation through dedicated thermal vias and conductive pathways, thus resolving the contradiction between miniaturization and reliability.
2Length of moving object
If thin-profile apparatus are used to achieve miniaturization, then the Z-height is reduced, but interconnection complexity increases
Solution Approach 1:
The patent transitions from planar interconnection to three-dimensional vertical interconnection using copper pillars and through-silicon vias. This allows multiple interconnect levels to be stacked vertically, reducing the lateral footprint and Z-height while managing complexity through vertical integration rather than horizontal expansion.
Solution Approach 2:
The interconnect structure employs a nested configuration where copper pillars are embedded within the molding compound, which itself is encapsulated within the interconnect package. The bare die is mounted on the interconnect package, creating nested layers that achieve thin-profile dimensions while maintaining complex interconnection capabilities through hierarchical organization.
3Reliability
If copper pillars are used for interconnection, then electrical conductivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The copper pillars are pre-formed and positioned within the molding compound before the bare die is mounted. This preliminary placement allows for precise positioning to be established during the molding process rather than during subsequent assembly steps, reducing the overall manufacturing precision requirements across the entire fabrication sequence.
Solution Approach 2:
The molding process itself serves multiple functions: it protects the copper pillars, positions them precisely, provides mechanical support, and creates the final package structure. The molding compound automatically provides the necessary positioning and support for the copper pillars, eliminating the need for separate precision alignment steps and self-correcting for minor variations in pillar placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves reduced Z-height and improved heat management, enabling efficient communication and protection of components, suitable for various computing devices.
Implementation Method 1
interconnections both active and passive devices require physical protection and heat management
Data Source
AI summary
A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor.