Bare Die Power Semiconductor Module Direct Coolant Cooling
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Solution Overview
Problem
Power semiconductor modules in motor vehicles face inefficiencies in cooling due to complex heat transfer paths and the need for tight seals, which complicates the use of cooling liquids and reduces thermal coupling effectiveness.
Innovation Solution
The power semiconductor chips are designed as bare dies without a housing, allowing direct cooling by an electrically insulating liquid, eliminating additional heat transfer paths and the need for complex seals and heat sinks, with a carrier element providing a path for coolant flow around the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power semiconductor chips are arranged on a heat sink with cooling channels, then cooling capability is improved, but device complexity increases due to seals and heat transfer paths
Solution Approach 1:
The invention extracts the housing from the power semiconductor chip, transforming it from a packaged component to a bare die. This eliminates the need for complex seals and heat transfer paths between the chip housing and heat sink, while maintaining effective cooling through direct thermal contact with the carrier element
Solution Approach 2:
The invention merges the chip housing function with the carrier element by directly mounting the bare die onto the carrier element's heat dissipation surface. This integration eliminates intermediate heat transfer components and creates a unified thermal management structure
2Reliability
If complex seals and heat transfer means are used, then tightness and thermal coupling are improved, but manufacturing effort increases
Solution Approach 1:
By removing the chip housing and using bare dies directly mounted on the carrier element, the invention eliminates multiple assembly steps involving seals, thermal paste, and precision alignment procedures, significantly reducing manufacturing complexity while maintaining reliable thermal coupling
3Reliability
If a long heat transfer path is used from chip to heat sink, then chip protection is improved, but heat dissipation efficiency decreases
Solution Approach 1:
The invention removes the chip housing that creates a long heat transfer path, allowing the bare die to be in direct thermal contact with the carrier element's heat dissipation surface. This dramatically shortens the thermal path and improves heat dissipation efficiency
Solution Approach 2:
Instead of protecting the chip through a housing that thermally isolates it, the invention inverts the approach by using the carrier element itself as both the mounting substrate and heat sink, creating direct thermal contact while providing mechanical support and protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and simplified cooling of power semiconductor chips, reducing manufacturing effort and enhancing heat dissipation directly on the chip surface, while maintaining electrical insulation and thermal management.
Implementation Method 1
a cooling liquid introduced through a cooling liquid supply line into the power semiconductor module flows directly around them
Implementation Method 2
A cooling liquid flows through the cooling channels and, because of the thermal coupling of the heat sink to the power semiconductor chips, dissipates the heat from them
Implementation Method 3
an electrically insulating liquid, eliminating additional heat transfer paths and the need for complex seals and heat sinks
Data Source
Figure 1~2
Figure 3
AI summary
Power semiconductor module for a motor vehicle, wherein several unpackaged power semiconductor chips (6) are provided which are arranged to be directly surrounded by a coolant (8) introduced into the power semiconductor module (1) by a coolant supply line (7).