Bare-Die Semiconductor Sensor Packaging for Fluid Sample Access
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Solution Overview
Problem
Conventional packaging technologies for semiconductor sensors fully encapsulate the die, restricting access to the active area and preventing interaction with fluid samples, which is necessary for diagnostic applications, and hinder the development of compact, user-friendly point-of-care diagnostic tools.
Innovation Solution
A packaged semiconductor sensor with an open detection area for fluid sample contact, using a support member with a detection window and conductive traces connected via z-axis adhesive, ensuring electrical connectivity and protection of the semiconductor die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If full encapsulation is used to protect the semiconductor die, then the integrity and functionality of the device is protected, but the active area is restricted and access to the detection area is prevented
Solution Approach 1:
The packaging structure is segmented into multiple functional zones: a sealed encapsulation region covering the bond pads and electrical connections, and an open detection area that remains exposed for sample access. This segmentation allows different parts of the semiconductor die to have different packaging treatments - the electrical connection areas are fully encapsulated while the detection area is kept open.
Solution Approach 2:
The packaging applies different protective qualities to different locations on the semiconductor die. The bond pads and electrical connections receive full encapsulation protection, while the detection area maintains an open, accessible quality to allow fluid sample contact. This local differentiation of packaging quality resolves the contradiction between protection and accessibility.
2Reliability
If traditional wire bonding and full encapsulation are used, then electrical connectivity is established and device protection is ensured, but the device size and complexity increase
Solution Approach 1:
The patent merges multiple functions into a single integrated packaging structure that simultaneously provides: mechanical support for the semiconductor die, electrical connection through conductive traces on the support member itself, and selective encapsulation. This consolidation eliminates the need for separate wire bonding and discrete encapsulation layers, reducing overall complexity.
Solution Approach 2:
The support member is designed as a multi-functional component that serves as both the mechanical substrate and the electrical interconnect structure. The conductive traces are formed directly on the support member, making it universally responsible for both structural support and electrical connectivity, thereby simplifying the overall device architecture.
3Object-affected harmful factors
If conventional packaging is used to protect the semiconductor die, then environmental factors are blocked, but the detection area cannot interact with fluid samples
Solution Approach 1:
The packaging structure segments the semiconductor die into protected and exposed regions. The encapsulation selectively covers only those areas vulnerable to environmental harm (bond pads, electrical connections), while leaving the detection area exposed to enable fluid sample interaction. This targeted segmentation resolves the contradiction between protection and adaptability.
Solution Approach 2:
The support member acts as an intermediary structure that provides environmental protection through its encapsulation while simultaneously enabling sample access through the open detection area. It mediates between the need for protection and the need for sample interaction by creating a differentiated packaging architecture.
Data Source
AI summary
The present invention relates to a novel packaging structure for a bare die semiconductor sensor, specifically designed for diagnostic applications where direct fluid sample contact with the sensor's detection area is required. The packaged semiconductor sensor comprises a semiconductor die with a top surface featuring bond pads and a detection area, and a bottom surface. A support member with a top side, a bottom side, and a detection window forms a sample well for receiving a fluid sample when aligned with the detection area. Z-axis conductive adhesive electrically connects bond pads to conductive traces on the support member. A sealing member seals the sample well, preserving sensor functionality while allowing the detection area exposure to the sample. This innovative packaging solution protects the sensor from environmental factors and maintains electrical integrity, enabling accurate and efficient biomarker detection in diagnostic procedures.