Thin-Film Barrier Film Density and Separation Layer
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Solution Overview
Problem
Existing methods for manufacturing flexible thin-film devices on resin substrates face challenges such as low yield due to adhesive forces between glass and resin substrates, and low barrier capability on the rear surface of the resin substrate, leading to moisture absorption and warping issues.
Innovation Solution
A thin-film device structure is developed with a dense inorganic barrier film formed on the rear surface of the resin substrate at a higher temperature than the resin's heat-resistant temperature, using a germanium oxide film as a separation layer that can be dissolved in hot water, allowing for high-yield separation of the glass substrate without mechanical force and enhancing barrier capability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a barrier film is formed on the rear surface of the resin substrate at low temperature (200°C or lower), then the resin substrate can withstand the process temperature, but the barrier capability is insufficient leading to moisture absorption and warping
Solution Approach 1:
The barrier film is divided into multiple layers: a first inorganic layer formed at low temperature on the resin substrate, and a second inorganic layer formed at high temperature on the first inorganic layer. This segmentation allows each layer to be optimized for its specific function - the first layer provides adhesion and low-temperature compatibility, while the second layer provides high barrier capability
Solution Approach 2:
The first inorganic layer is formed in advance on the resin substrate before the second inorganic layer is formed. This preliminary action creates a foundation that can withstand subsequent high-temperature processing, enabling the second layer to achieve high barrier properties without damaging the resin substrate
2Productivity
If glass substrate and resin substrate are separated using mechanical force, then separation can be achieved, but yield is reduced due to adhesive forces between the substrates
Solution Approach 1:
A germanium oxide film is introduced as an intermediary layer between the glass substrate and the first inorganic layer. This intermediary layer serves as a separation layer that can be dissolved in hot water, allowing the glass substrate to be separated from the resin substrate without mechanical force and without damaging the thin-film elements
Solution Approach 2:
The mechanical separation process is replaced with a chemical dissolution process. Instead of using mechanical force to separate the glass substrate from the resin substrate, the germanium oxide film is dissolved in hot water, enabling separation without mechanical stress and improving yield
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the yield and reliability of flexible thin-film devices by forming a dense inorganic barrier film with high barrier capability on the rear surface of the resin substrate, preventing moisture absorption and warping, and enabling the production of stable flexible displays like organic EL and liquid crystal displays.
Implementation Method 1
using a germanium oxide film as a separation layer that can be dissolved in hot water
Implementation Method 2
forming a dense inorganic barrier film with high barrier capability on the rear surface of the resin substrate, preventing moisture absorption
Data Source
AI summary
A thin-film device includes a resin film which includes a first surface and a second surface facing the first surface, a first inorganic layer on the first surface, a thin-film element on the first inorganic layer, and a second inorganic layer on the second surface, wherein a film density of the second inorganic layer is greater than a film density of the first inorganic layer.