Barrier Layer Packaging for Corrosion-Resistant Die Attach
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Solution Overview
Problem
Semiconductor devices face corrosion and cracking issues due to corrosive ions from the sealing resin interacting with the element joining layer, leading to reduced heat dissipation and reliability, especially under thermal stress and large current conditions.
Innovation Solution
A barrier layer, such as aluminum oxide, is formed between the sealing resin and the element joining layer to block corrosive ions, preventing corrosion and maintaining the structural integrity and heat dissipation capabilities of the element joining layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sealing resin directly contacts the element joining layer, then the device structure is simple, but corrosive ions from the sealing resin cause corrosion and cracking in the element joining layer
Solution Approach 1:
A barrier layer is introduced as an intermediary between the sealing resin and the element joining layer. This barrier layer prevents direct contact between corrosive ions from the sealing resin and the element joining layer, thereby eliminating corrosion and cracking issues while maintaining overall structural simplicity.
Solution Approach 2:
The interface region between the sealing resin and element joining layer is segmented by introducing a separate barrier layer. This segmentation isolates the corrosive environment from the sensitive element joining layer, protecting it from degradation while allowing the sealing resin to perform its encapsulation function.
2Reliability
If the element joining layer is exposed to corrosive ions, then the manufacturing process is simple, but heat dissipation capability deteriorates due to corrosion and cracking
Solution Approach 1:
The barrier layer serves as a protective intermediary that shields the element joining layer from corrosive ions. This prevents corrosion-induced degradation of heat dissipation pathways, ensuring reliable thermal management without complicating the manufacturing process.
Solution Approach 2:
The barrier layer is formed in advance before the sealing resin is applied, creating a pre-protective shield against corrosive ions. This preliminary protective action prevents future corrosion damage to the element joining layer's heat dissipation functionality.
3Power
If thermal stress and large current conditions are applied, then the device operates at high performance, but corrosion and cracking accelerate in the element joining layer
Solution Approach 1:
The barrier layer acts as a protective intermediary that isolates the element joining layer from corrosive ions, even under high thermal stress and large current conditions. This ensures structural integrity is maintained during high-power operation.
Solution Approach 2:
The barrier layer provides beforehand protection against corrosion that would otherwise be accelerated by thermal stress and large currents. This prior cushioning prevents the synergistic degradation effect of combined thermal and chemical stressors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The barrier layer effectively suppresses corrosion and cracking in the element joining layer, ensuring reliable heat dissipation and structural integrity even under thermal stress and large current conditions, enhancing the overall performance and reliability of the semiconductor device.
Implementation Method 1
a barrier layer which is formed at a boundary portion between the sealing resin and the element joining layer and blocks corrosive ions derived from the sealing resin
Data Source
AI summary
A semiconductor device includes a die pad, a semiconductor element which is disposed on the die pad, an element joining layer which is formed between the die pad and the semiconductor element and joins the semiconductor element to the die pad, a sealing resin which covers the die pad, the semiconductor element, and the element joining layer, and a barrier layer which is formed at a boundary portion between the sealing resin and the element joining layer and blocks corrosive ions derived from the sealing resin. The sealing resin may have an end surface which forms a peripheral outer shape of the sealing resin, and the die pad may include a protruding portion which protrudes outside the sealing resin, with the end surface of the sealing resin given as a starting point.