Power Module Barrier Layer Structure for Stable Stacking
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Solution Overview
Problem
Existing power semiconductor modules face difficulties in stabilizing barrier layers during stacking and mounting due to their structure, which can lead to instability and tilting, affecting the reliability and environmental resistance of the semiconductor devices.
Innovation Solution
A semiconductor device design featuring a barrier layer with a convex part protruding from its surface, where the convex part is positioned on both sides of the center, allowing the barrier layer to be stacked stably by housing the protrusion within the convex parts, preventing tilting and ensuring stable contact with the sealing resin, thereby enhancing environmental resistance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If the barrier layer is designed with a protruding structure to form a stress relaxation part, then stress distribution is improved, but the barrier layer becomes unstable and may tilt or fall during stacking and mounting
Solution Approach 1:
The barrier layer employs an asymmetric structure where the first surface is recessed relative to the second surface, creating a stepped configuration. This asymmetric design allows the barrier layer to fit into the sealing member's stress relaxation part while maintaining stability during stacking and mounting operations, preventing tilting or falling.
Solution Approach 2:
The barrier layer is nested within the sealing member structure, where the recessed first surface of the barrier layer fits into the stress relaxation part of the sealing member. This nesting arrangement provides stable positioning and prevents the barrier layer from tilting or falling during handling and mounting.
2Stability of the object's composition
If the barrier layer is made flat and stable for stacking, then stacking stability is improved, but stress relaxation capability is reduced
Solution Approach 1:
The barrier layer features localized structural variations: the first surface is recessed while the second surface remains protruding. This local quality differentiation allows specific regions to provide stress relaxation functionality while maintaining overall stacking stability through the stepped configuration that fits into the sealing member's stress relaxation part.
Data Source
AI summary
According to an aspect of the first disclosure, a semiconductor device includes a base plate, a case that surrounds a region immediately above the base plate, a semiconductor chip provided in the region, a sealing resin that fills the region and a barrier layer provided on the sealing resin, wherein the barrier layer has a first surface facing the base plate, a second surface opposite to the first surface, and a convex part protruding upward from the second surface, the first surface has a longer distance to the base plate as getting farther from the center, the convex part is provided avoiding the center, and a height of the convex part is greater than a distance in a thickness direction of the barrier layer between a portion of the first surface immediately below the convex part and a portion of the first surface provided at the center.