Barrier-Layer Optoelectronic Foil for Moisture-Resistant Transparency
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Solution Overview
Problem
Optoelectronic flexible foils exhibit poor barrier properties against moisture and oxygen, leading to the degradation of organic materials in devices like OLEDs, resulting in a short lifespan and sensitivity to weather conditions, while existing solutions compromise on transparency or durability.
Innovation Solution
A flexible optoelectronic foil with a layered structure comprising a transparent substrate, a barrier layer made of materials like silicon oxides and aluminium oxides, and a conductive layer with oxide and metal layers, deposited using techniques such as atomic layer deposition and magnetron sputtering, to achieve low water vapor permeability and maintain transparency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible polymer foil substrate is used, then flexibility is achieved, but barrier properties against moisture and oxygen deteriorate
Solution Approach 1:
The patent applies composite materials by combining a flexible polymer foil substrate with a barrier layer made of inorganic materials (such as aluminum oxide, silicon oxide, or titanium oxide) deposited through atomic layer deposition. This composite structure maintains the flexibility of the polymer while providing effective barrier properties against moisture and oxygen, resolving the contradiction between flexibility and barrier performance.
2Reliability
If ultra-thin metal or glass foils are used to improve barrier properties, then gas permeability improves, but transparency deteriorates and durability worsens
Solution Approach 1:
The patent uses thin film technology by depositing barrier layers with thickness of 5-500 nm through atomic layer deposition. These thin inorganic barrier layers provide effective gas permeability protection while maintaining transparency, avoiding the opacity issue associated with ultra-thin metal or glass foils. The thin film structure allows light transmission while providing the necessary barrier properties.
3Duration of action of stationary object
If a barrier layer is added to improve tightness, then lifespan is extended, but device complexity increases
Solution Approach 1:
The patent replaces mechanical sealing methods with a chemical vapor deposition process (atomic layer deposition). Instead of using complex multi-layer foil structures or mechanical sealing techniques, the invention uses ALD to deposit conformal inorganic barrier layers that provide effective protection against moisture and oxygen. This substitution of mechanical systems with a deposition process simplifies the overall device structure while extending lifespan.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The foil achieves a water vapor transmission rate between 10^-3 and 10^-6 g/m² per day, extending the lifespan of optoelectronic devices while maintaining high transparency and flexibility, suitable for various applications including flexible OLED displays and photovoltaic systems.
Implementation Method 1
a barrier layer (12) on the substrate (11), wherein the barrier layer (12) consists of at least one material selected from the group consisting of silicon oxides (SiOx), aluminium oxides (Al2O3, AlOxNy), titanium oxides (TiOx), silicon oxynitrides SiON, silicon nitrides (Si3N4, SiNx), organic silicon compounds (SiCxHy), zirconium oxide (ZrO2), hafnium oxide (HfO2), chromium oxides (CrO, Cr2O3, CrO2, CrO3, CrO5) and parylene
Implementation Method 2
deposited using techniques such as atomic layer deposition and magnetron sputtering
Implementation Method 3
deposited using techniques such as atomic layer deposition and magnetron sputtering
Data Source
Figure 1~3
AI summary
An optoelectronic foil characterised in that it comprises a substrate (11) and a conductive layer (13) comprising at least one oxide layer (131, 133) and at least one metal layer (132), wherein between the conductive layer (13) and the substrate (11) of the foil (10) there is a barrier layer (12) comprising at least one material selected from the group consisting of silicon oxides (SiOx), aluminium oxides (AI2O3, AlOxNy), titanium oxides (TiOx), silicon oxynitrides SiON, silicon nitrides (Si3N4, SiNx), organic silicon compounds (SiCxHy), zirconium oxide (ZrO2), hafnium oxide (HfO2), chromium oxides (CrO, Cr2O3, CrO2, CrO3, CrO5) and parylene.