Cu Diffusion Barrier Plating Layer Stress Management
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Solution Overview
Problem
The adhesivity between the barrier film and the substrate is weakened due to stress generated during the baking process in the formation of Cu diffusion barrier films, which can lead to peeling issues in multilayer wiring technologies.
Innovation Solution
A plating method and system that involves forming a plating layer stacked body by repeating a plating layer forming process and baking process at least twice, with the first plating layer being baked to enhance adhesion and the second layer being baked to remove moisture, thereby reducing stress and maintaining adhesivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the barrier film is baked to remove moisture and strengthen metal bonds, then the bond strength between metals is improved, but stress is generated between the barrier film and substrate causing adhesivity to weaken
Solution Approach 1:
The barrier film is divided into multiple thin layers (first barrier film layer, second barrier film layer, third barrier film layer) instead of forming a single thick layer. This segmentation allows each layer to be baked separately at controlled temperatures, removing moisture gradually while minimizing stress accumulation and preventing adhesion failure between the barrier film and substrate.
2Reliability
If the plating layer thickness is increased to ensure sufficient barrier function, then the Cu diffusion barrier performance is improved, but the stress during baking increases causing peeling
Solution Approach 1:
The thick plating layer is segmented into multiple thin layers with different compositions (Co-W-B, Co-P, Co-W). Each thin layer provides sufficient Cu diffusion barrier performance while the reduced thickness of individual layers minimizes baking stress, preventing peeling while maintaining overall barrier functionality.
Solution Approach 2:
The invention uses composite material structure with multiple barrier film layers having different compositions (Co-W-B, Co-P, Co-W). This composite structure provides effective Cu diffusion barrier performance while the varied compositions allow for optimized baking characteristics of each layer, reducing overall stress and improving adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the adhesion between the plating layers and the underlying substrate, reducing peeling risks and maintaining strong adhesion even after baking, thus improving the reliability of the Cu diffusion barrier film.
Implementation Method 1
forming a plating layer having a preset function by performing the plating process on the substrate with a plating liquid
Implementation Method 2
baking the plating layer by heating the substrate
Data Source
AI summary
A plating method can improve adhesivity with an underlying layer. The plating method of performing a plating process on a substrate includes forming a first plating layer 23a serving as a barrier film on a substrate 2; baking the first plating layer 23a; forming a second plating layer 23b serving as a barrier film; and baking the second plating layer 23b. A plating layer stacked body 23 serving as a barrier film is formed of the first plating layer 23a and the second plating layer 23b.