Barrier Rib OLED Structure for Maskless Sensor Integration
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Solution Overview
Problem
Existing electronic devices face challenges in manufacturing light emitting elements without using metal masks, which can affect process reliability and product size, particularly in creating efficient and reliable sensor structures.
Innovation Solution
The electronic device incorporates a barrier rib structure with conductive portions and insulating gaps, allowing for the integration of a light emitting element without a metal mask, enhancing process reliability and enabling product downsizing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a metal mask is used to manufacture light emitting elements, then manufacturing precision is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes the metal mask from the manufacturing process entirely. Instead of using a metal mask to define the light emitting opening, the invention uses a barrier rib structure with insulating material that is patterned and etched to create the opening. This extraction of the metal mask component simplifies the manufacturing process while maintaining precision through alternative means.
Solution Approach 2:
The patent introduces a barrier rib structure with insulating material as an intermediary element between the pixel defining film and the light emitting element. This intermediary structure serves the function previously performed by the metal mask, providing precise definition of the light emitting opening without requiring metal mask fabrication steps.
2Reliability
If conventional manufacturing methods are used, then process reliability is maintained, but product size cannot be reduced
Solution Approach 1:
The patent utilizes the vertical dimension by creating a barrier rib structure that extends upward from the pixel defining film. This three-dimensional structure allows for precise control of the light emitting opening size and position, enabling device downsizing while maintaining manufacturing reliability through the added dimensional control.
Solution Approach 2:
The barrier rib structure is nested within the pixel defining film structure, with the insulating material forming a contained structure that holds the light emitting opening in place. This nested configuration allows for compact device design while maintaining process reliability through the integrated structure.
3Adaptability or versatility
If sensor electrodes are added to the device structure, then sensor functionality is improved, but device complexity increases
Solution Approach 1:
The patent merges the sensor electrode structure with the existing barrier rib and encapsulation layer structure. The first conductive layer is integrated into the barrier rib structure, and the second conductive layer is positioned within the encapsulation layers, combining multiple functions into a unified structure that reduces overall device complexity.
Solution Approach 2:
The barrier rib structure serves multiple functions: it defines the light emitting opening, provides electrical isolation between conductive portions, supports the sensor electrodes, and integrates with the encapsulation layers. This multi-functionality reduces the need for separate structural components, thereby reducing device complexity.
4Reliability
If conductive portions are insulated in the barrier rib, then electrical isolation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies different material properties to different regions of the barrier rib structure. The insulating material is used in specific regions where electrical isolation is needed, while conductive material is used in other regions for electrical connection. This localized application of different material qualities achieves reliable electrical isolation without requiring high precision throughout the entire structure.
Solution Approach 2:
The barrier rib structure is segmented into distinct conductive and insulating portions. The insulating material forms separate regions that electrically isolate the conductive portions from each other. This segmentation allows for reliable electrical isolation through material-based differentiation rather than relying solely on precise dimensional control.
Data Source
AI summary
An electronic device is disclosed that includes a base layer, a pixel defining film disposed on the base layer and having a light emitting opening defined therein, a barrier rib disposed on the pixel defining film, having conductivity, and including a first portion having a first barrier rib opening corresponding to the light emitting opening and a second portion insulated from the first portion, a light emitting element disposed in the light emitting opening and including an anode, an intermediate layer disposed on the anode, and a cathode disposed on the intermediate layer and connected to the first portion, a first encapsulation layer covering the cathode, a second encapsulation layer covering the light emitting opening and the first barrier rib opening, a third encapsulation layer disposed on the second encapsulation layer, and a sensor disposed on the light emitting element and including a first sensor electrode and a second sensor electrode, wherein the sensor includes a first conductive layer disposed between the second encapsulation layer and the third encapsulation layer and a second conductive layer disposed on the third encapsulation layer, and the first conductive layer is electrically connected to the second portion through the first encapsulation layer.