Base Die ECC Encoding for Memory System Data Accuracy
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Solution Overview
Problem
In semiconductor memory systems, the lack of error checking and correction functionality in the base die leads to increased die area pressure on processors and memory dies, affecting storage performance and accuracy.
Innovation Solution
The base die is equipped with error checking and correction capabilities, performing ECC encoding and decoding processes to alleviate die area constraints and enhance data accuracy, by receiving and processing data from both the processor and memory die, thereby sharing the encoding and error correction functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If error checking and correction functionality is implemented in the processor or memory die, then data accuracy is improved, but die area pressure increases
Solution Approach 1:
The error checking and correction functionality is segmented from the processor and memory die, and distributed to the base die. The base die receives data from the processor, performs ECC encoding, and stores it in the memory die. During reading, the base die performs error checking and correction on retrieved data before forwarding to the processor. This segmentation reduces die area pressure on the processor and memory die while maintaining data accuracy through distributed error correction capabilities.
2Reliability
If ECC encoding and error correction processing is performed, then data accuracy is improved, but processing time increases
Solution Approach 1:
ECC encoding is performed in advance during the writing phase before data is stored in the memory die. The base die encodes the data received from the processor and stores both the original and encoded data in the memory die. This preliminary encoding action ensures that error correction capabilities are already in place when data is retrieved, reducing the time penalty during reading operations since the correction mechanisms are pre-positioned.
Data Source
AI summary
A base die is configured to: receive a first data and a first encoded data in a writing phase, where the first encoded data is obtained by performing a first error correction code (ECC) encoding processing on the first data, perform a second ECC encoding processing on a first sub-data to generate a second encoded data, and transmit a second data to a memory die in the writing phase; where the second data includes the first sub-data, a second sub-data, the first encoded data, and the second encoded data; the base die is further configured to: receive the second data from the memory die in a reading phase, perform first error checking and correction processing on the first sub-data and the second encoded data, and transmit a third data in the reading phase.