Base-Die Network-on-Chip Access for Programmable Logic Fabric
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Solution Overview
Problem
In multi-dimensional die systems, programmable logic devices face challenges in incorporating a network-on-chip (NOC) within the fabric die due to space constraints and performance impacts, limiting data communication between sectors and reducing the fabric's capabilities.
Innovation Solution
The implementation of a network-on-chip (NOC) on a separate base die that supports the programmable logic fabric, allowing for data communication across the fabric via the base die, which enhances bandwidth, provides alternative pathways, and enables reconfiguration and security features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If NOC is integrated within the fabric die, then data communication capability is improved, but space availability and fabric performance are reduced
Solution Approach 1:
The patent divides the system into two separate dies: the fabric die containing only programmable logic fabric, and the base die containing the NOC infrastructure. This segmentation allows each die to be optimized for its specific function, with the fabric die maintaining maximum space for logic elements and the base die housing the communication network, thereby resolving the space conflict while preserving communication capability.
Solution Approach 2:
The base die acts as an intermediary between different fabric dies, providing the NOC infrastructure that enables data communication without requiring space on the fabric dies themselves. The base die's NOC router and communication interfaces mediate data transfer between fabric sectors, eliminating the need to integrate NOC directly into the fabric die.
2Reliability
If NOC is integrated within the fabric die, then data communication capability is improved, but fabric performance and capabilities are reduced
Solution Approach 1:
By separating the fabric die from the base die containing NOC, the patent ensures that fabric resources are dedicated entirely to logic operations without being shared with or constrained by NOC infrastructure. This segmentation allows the fabric to operate at full performance while the base die handles all communication functions.
Solution Approach 2:
The base die serves as an intermediary that handles all data communication tasks, allowing the fabric die to focus exclusively on computation and logic operations. This mediator approach ensures that fabric performance is not degraded by NOC integration while maintaining robust data communication capabilities through the base die's dedicated communication infrastructure.
3Area of stationary object
If NOC is placed on a separate base die, then space on fabric die is preserved, but communication bandwidth may be limited
Solution Approach 1:
The patent transitions from a two-dimensional integration approach (NOC on the same die as fabric) to a three-dimensional stacked architecture where the base die with NOC is vertically positioned beneath the fabric die. This dimensional change enables high-bandwidth communication through vertical interconnects (microbumps) while preserving all fabric die space for logic operations.
Solution Approach 2:
The base die's NOC infrastructure acts as an intermediary that provides high-bandwidth communication paths between fabric dies. The dedicated communication interfaces and routing resources on the base die ensure sufficient bandwidth is available to support fabric operations without requiring space on the fabric die itself.
Data Source
AI summary
An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die, such that the programmable logic fabric may include a first region of programmable logic fabric and a second region of programmable logic fabric. The first region of programmable logic fabric is configured to be programmed with a circuit design that operates on a first set of data. The integrated circuit may also include network on chip (NOC) circuitry disposed on a second integrated circuit die, such that the NOC circuitry is configured to communicate data between the first integrated circuit die and the second integrated circuit die.