Base Die TSV Heat Paths for Stacked Die Thermal Resistance
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Solution Overview
Problem
Legacy stacked die architectures face significant thermal challenges due to die-to-die heating, which diminishes thermal performance and prevents effective thermal coupling between base dies and thermal interface materials or integrated heat spreaders.
Innovation Solution
The implementation of thermally conductive features such as through-silicon vias (TSVs) and dummy dies with high thermal conductivity materials to route thermal energy away from top dies, thereby reducing thermal resistance and enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If legacy stacked die architectures are used, then device size is reduced, but thermal performance deteriorates due to die-to-die heating
Solution Approach 1:
The patent segments the thermal management function by introducing separate thermal pathways through TSVs in the base die. Instead of relying on a single heat flow path through the stacked dies, the thermal conduction paths are divided into multiple independent routes: one through the thermal interface material and another through the TSV-based heat spreader, allowing thermal energy to be distributed and dissipated more effectively
Solution Approach 2:
The patent introduces a heat spreader as an intermediary component that couples to the base die through TSVs. This heat spreader acts as a thermal mediator between the base die and the surrounding thermal environment, facilitating more efficient heat transfer and distribution away from the stacked die assembly without requiring modification of the die stack itself
2Loss of energy
If thermal interface materials are thermally coupled to base dies, then cooling efficiency improves, but thermal resistance increases due to die-to-die heating
Solution Approach 1:
The patent merges multiple thermal conduction paths by combining the thermal interface material pathway with the TSV-based heat spreader pathway. These parallel thermal paths work together to conduct heat away from the base die, effectively reducing the overall thermal resistance by providing redundant and complementary heat flow routes that operate simultaneously
3Reliability
If through-silicon vias with thermally conductive material are implemented, then thermal resistance is reduced, but device complexity increases
Solution Approach 1:
The patent implements TSVs that serve multiple functions: they provide electrical interconnections between stacked dies and simultaneously function as thermal conduction pathways through their thermally conductive material filling. This multi-functionality allows the same structural feature to address both electrical and thermal requirements, reducing the need for separate dedicated thermal structures and thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces overall thermal resistance, allows for better cooling routes for base dies, and enables stacked die architectures to operate at higher power levels before reaching maximum chip temperatures, while also reducing the power required for cooling.
Implementation Method 1
TSVs in passive areas of base dies route thermal energy away from a plurality of top dies
Implementation Method 2
dummy dies coupled with some of the base dies to route thermal energy away from the plurality of top dies
Data Source
AI summary
Embodiments of the present disclosure may generally relate to systems, apparatuses, techniques, and/or processes directed to packages that include stacked dies that use thermal conductivity features including thermally conductive through silicon vias (TSVs) filled with thermally conductive material located in passive areas of a first die to route heat from a first die away from a second die that is coupled with the first die. In embodiments, the first die may be referred to as a base die. Embodiments may include thermal blocks in the form of dummy dies that include TSVs at least partially filled with thermal energy conducting material such as copper, solder, or other alloy.