Base-Free Thermoelectric Module Structure for Thin Serial Chip Integration

Solution Overview

Problem

Existing thermoelectric conversion modules require a support base material, hindering thinning and material reduction, and existing solutions with contact heat conductive layers do not adequately address these issues.

Innovation Solution

A self-standing thermoelectric conversion module is designed without a support base material by directly disposing electrodes on both surfaces of an integrated body comprising alternately spaced chips of P-type and N-type thermoelectric materials, filled with an insulator, and optionally using a hardenable pressure-sensitive adhesion agent layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a support base material is used to hold metal electrodes and thermoelectric elements, then structural stability is improved, but module thickness increases and material quantity increases

Engineering Contradiction:

Improvestructural stabilityVSAvoidmodule thickness

Core Design Contradiction:

Stability of the object's compositionVSLength of stationary object

Solution Approach 1:

The invention extracts and eliminates the support base material from the thermoelectric conversion module structure. By directly forming electrodes on the thermoelectric element surfaces and using the element substrates themselves for mechanical support, the design removes the separate support base component, thereby reducing module thickness while maintaining structural stability through the integrated element-substrate-electrode system.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the functions of the support base material with the thermoelectric element substrates and electrode structures. The substrates serve dual purposes as both mechanical supports and mounting surfaces for electrodes, while the electrode layers themselves provide structural reinforcement. This functional merging eliminates the need for a separate support base, reducing overall module thickness.

Inventive Principle:

Principle #5Merging (Combining)

2Stability of the object's composition

If a support base material is used to hold metal electrodes and thermoelectric elements, then structural stability is improved, but the number of constituting materials increases

Engineering Contradiction:

Improvestructural stabilityVSAvoidnumber of constituting materials

Core Design Contradiction:

Stability of the object's compositionVSQuantity of substance

Solution Approach 1:

The invention extracts and eliminates the support base material from the thermoelectric conversion module structure. By directly forming electrodes on the thermoelectric element surfaces and using the element substrates themselves for mechanical support, the design removes the separate support base component, thereby reducing module thickness while maintaining structural stability through the integrated element-substrate-electrode system.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention makes the thermoelectric element substrates multi-functional by using them as both the active thermoelectric component mounting surfaces and the mechanical support structure. The substrates simultaneously serve as electrical connection bases, mechanical supports, and structural frameworks, eliminating the need for separate support base materials and reducing the total number of constituting materials.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If a contact heat conductive layer made of aluminum nitride, silicon nitride, alumina is provided, then thermal conduction is improved, but the layer functions as a support base material thus increasing module thickness

Engineering Contradiction:

Improvethermal conductionVSAvoidmodule thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The invention extracts and eliminates the support base material from the thermoelectric conversion module structure. By directly forming electrodes on the thermoelectric element surfaces and using the element substrates themselves for mechanical support, the design removes the separate support base component, thereby reducing module thickness while maintaining structural stability through the integrated element-substrate-electrode system.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the functions of the support base material with the thermoelectric element substrates and electrode structures. The substrates serve dual purposes as both mechanical supports and mounting surfaces for electrodes, while the electrode layers themselves provide structural reinforcement. This functional merging eliminates the need for a separate support base, reducing overall module thickness.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves a thin thermoelectric conversion module suitable for narrow spaces, eliminating the need for a support base material and enabling efficient thermal and electrical connections.

Implementation Method 1

an insulator configured to fill a gap defined by a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

a common first electrode provided on one surface of the integrated body and joining one surface of the chip of the P-type thermoelectric conversion material and one surface of the chip of the N-type thermoelectric conversion material; and a common second electrode provided on another surface of the integrated body

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

a device that directly inter-converts thermal energy and electrical energy using a thermoelectric conversion module having a thermoelectric effect such as a Seebeck effect or a Peltier effect

Methodology Applied

Scientific EffectSeebeck effect: Seebeck Effect

Implementation Method 4

a device that directly inter-converts thermal energy and electrical energy using a thermoelectric conversion module having a thermoelectric effect such as a Seebeck effect or a Peltier effect

Methodology Applied

Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS12408551B2Thermoelectric conversion module

Publication Date: 2025.09.02 LINTEC CORP

AI summary

Provided is a thin thermoelectric conversion module provided with no support base material and including: an integrated body including an insulator configured to fill a gap defined by a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material, the chips being alternately arranged and spaced apart from each other; a common first electrode provided on one surface of the integrated body and joining one surface of the chip of the P-type thermoelectric conversion material and one surface of the chip of the N-type thermoelectric conversion material; and a common second electrode provided on another surface of the integrated body, facing the first electrode, and joining another surface of the chip of the N-type thermoelectric conversion material and another surface of the chip of the P-type thermoelectric conversion material, in which the first electrode and the second electrode provide electrically serial connection between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material, and both surfaces of the thermoelectric conversion module are provided with no base material.