Base Layer Architecture Infrastructure Device for Data Center Thermal Management
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Solution Overview
Problem
Current data center rack systems face inefficiencies in temperature management, power distribution, and signal propagation due to variables like component placement, density, and thermal impedance, leading to reduced cooling effectiveness and increased power consumption.
Innovation Solution
A base layer architecture (BLA) infrastructure device comprising a power base layer, cold thermal base layer, hot thermal base layer, optical base layer, and radio frequency base layer, which supply resources like power, cooling fluids, and signals to cartridges, with integrated interfaces for efficient management and alignment within the rack.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional rack systems are used with conventional component placement, then component density can be increased, but cooling effectiveness deteriorates due to thermal impedance and hot/cold aisle formation
Solution Approach 1:
The patent segments the cooling system into multiple independent cooling zones with dedicated cold plates for each component or component group. This allows independent temperature control for each segment, preventing thermal interference between components and maintaining cooling effectiveness even at high component densities.
Solution Approach 2:
The patent implements local quality by providing customized cooling solutions for different components based on their specific thermal requirements. Each component receives tailored cooling through dedicated cold plates with optimized thermal contact, ensuring that each location receives appropriate cooling intensity rather than uniform cooling across the entire system.
2Temperature
If more cooling components are added to improve cooling effectiveness, then temperature control improves, but device complexity and space consumption increase
Solution Approach 1:
The patent merges multiple cooling functions into integrated cold plates that simultaneously serve as thermal management devices and structural components. The cold plates are directly coupled to component bases, combining cooling functionality with mechanical support, which reduces the number of separate cooling components needed and simplifies the overall system architecture.
Solution Approach 2:
The cold plates serve multiple functions: they provide thermal management through direct contact cooling, act as structural support for components, and serve as mounting surfaces for other components. This multi-functionality reduces the need for separate dedicated cooling components, thereby reducing system complexity while maintaining effective cooling.
3Reliability
If conventional power and signal distribution methods are used, then infrastructure can be maintained, but power efficiency deteriorates and signal propagation becomes less effective
Solution Approach 1:
The patent extracts power distribution functionality from traditional PCB traces and separate power supply components, implementing direct power delivery through the mechanical interface of the cartridge assembly. Power contacts are integrated into the cartridge base and directly couple with rack power contacts, eliminating intermediate power distribution stages and reducing power loss.
Solution Approach 2:
The cartridge base assembly serves as an intermediary that integrates multiple functions including mechanical support, thermal management, and power distribution. This intermediary structure consolidates previously separate functions into a single integrated component, improving both power efficiency and signal propagation while maintaining infrastructure reliability.
4Adaptability or versatility
If large motherboards are used to accommodate all components, then component integration is achieved, but cooling efficiency deteriorates and space utilization becomes inefficient
Solution Approach 1:
The patent segments the system into modular cartridges that can be independently cooled and configured. Instead of a single large motherboard with all components, functional groups are placed in separate cartridges, each with its own dedicated cooling path. This segmentation allows optimized cooling for each functional module while maintaining overall system integration.
Solution Approach 2:
The patent transitions from planar component arrangement on a large motherboard to a three-dimensional modular cartridge architecture. Components are vertically stacked in cartridges that can be arranged in racks, utilizing vertical space efficiently. This dimensional change enables better thermal management through direct cold plate contact and improved space utilization in the rack environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The BLA infrastructure device enhances cooling efficiency, reduces the need for large motherboards, promotes flexible power and network connectivity, and allows for more efficient data center usage by eliminating hot and cold aisles, thereby improving overall system performance and reducing costs.
Implementation Method 1
a cold thermal base layer to cool the cartridge
Implementation Method 2
a hot thermal base layer to remove heat from the cartridge
Data Source
AI summary
A base layer architecture (BLA) infrastructure device comprises a power base layer (PBL) to supply power to a cartridge, a cold thermal base layer (cold TBL) to cool the cartridge, a hot thermal base layer (hot TBL) to remove heat from the cartridge, an optical base layer (OBL) to transmit an optical signal to the cartridge and a radio frequency base layer (RBL) to transmit a radio frequency signal to the cartridge. Each base layer comprises a rack interface to couple the base layer to a rack and a number of cartridge interfaces to couple the base layers to the cartridge. A BLA infrastructure system comprises a BLA infrastructure device comprising a number of base layers. The number of base layers are removably coupled to a rack and a system management device to manage the number of base layers.