Base Plate With Bridge Chip For Proximity Communication In Multi-Chip Modules
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Solution Overview
Problem
Existing multi-chip modules (MCMs) face high costs and extended design-cycle times due to complex wire routing and customized designs for specific applications, especially when integrating ASICs from different vendors, which complicates thermal mechanical package design and proximity-communication channel performance.
Innovation Solution
A base mechanism for MCMs featuring a substrate with through-substrate vias and a bridge chip for proximity communication, along with spacers defining cavities for additional electrical connectors, allowing for a common configuration that can accommodate different island chips with varying proximity communication connectors, facilitating faster development and reduced costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If all I/O connections pass through the substrate, then electrical connectivity is achieved, but substrate cost and routing complexity significantly increase
Solution Approach 1:
The patent extracts the communication function from the substrate routing and relocates it to the chip surfaces through proximity communication interfaces. This removes the need for complex through-substrate wire routing while maintaining electrical connectivity, directly addressing the contradiction between reliability and device complexity.
Solution Approach 2:
The patent introduces proximity communication interfaces as intermediary components on chip surfaces that mediate data transmission between chips. This intermediary approach replaces the traditional substrate-mediated routing, reducing substrate complexity while preserving connectivity functionality.
2Reliability
If customized designs are used for specific applications, then performance is optimized, but design-cycle time increases
Solution Approach 1:
The patent creates a universal base plate design with standardized proximity communication interfaces that can accommodate multiple applications and chip configurations. This universal approach allows the same base infrastructure to serve different applications, reducing design-cycle time while maintaining application-specific performance through configurable chip arrangements.
Solution Approach 2:
The patent segments the MCM design into a standardized base plate component and application-specific chip components. This segmentation allows the base plate to be designed once and reused across applications, while only the chip-level design needs customization, significantly reducing overall design-cycle time.
3Adaptability or versatility
If heterogeneous ASICs from different vendors are integrated, then versatility is improved, but package design complexity increases
Solution Approach 1:
The patent implements universal proximity communication interfaces on the base plate that can interface with ASICs from different vendors. This universality allows heterogeneous integration while maintaining standardized package design, reducing package design complexity despite vendor diversity.
Solution Approach 2:
The patent applies local quality by allowing each ASIC to have its specific communication interface characteristics while maintaining a standardized overall package structure. The base plate provides localized adaptation points that accommodate different vendor specifications without compromising the global package design simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a lower-cost, faster development of MCMs by decoupling the design of island chips and base plates, accommodating heterogeneous ASICs, and reducing the complexity of substrate design, thus lowering costs and time-to-market while maintaining effective communication.
Implementation Method 1
through-substrate vias (TSVs) between the first surface and the second surface are electrically coupled to the first electrical connectors
Implementation Method 2
proximity communication connectors, disposed on a top surface of the bridge chip, that communicate information via proximity communication with one or more island chips in the MCM
Data Source
AI summary
A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors that convey power, and through-substrate vias (TSVs) between the top and bottom surfaces are electrically coupled to these electrical connectors. Furthermore, a bridge chip is rigidly mechanically coupled to the top surface. This bridge chip includes proximity communication connectors that communicate information via proximity communication with one or more island chips in the MCM. Additionally, spacers are rigidly mechanically coupled to the top surface of the substrate. In conjunction with the bridge chip, the spacers define cavities on the top surface, which include second electrical connectors. These second electrical connectors are electrically coupled to the TSVs, and communicate additional information with and convey power to the one or more island chips.