Base Plate Plating Layout for Semiconductor Heat Dissipation
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Solution Overview
Problem
Existing semiconductor devices face challenges in effectively dissipating heat and ensuring reliable electrical connections while maintaining corrosion resistance and structural integrity, particularly in the interface between the metal base and insulating substrate.
Innovation Solution
A semiconductor device design featuring a heat dissipation base plate with a solder region and an alloy layer containing a solder component, along with a plating film on the base plate, enhances thermal conductivity and corrosion resistance, and improves the bonding between the metal and insulating components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating film is formed on the entire surface of the heat dissipation base plate, then corrosion resistance is improved, but heat dissipation performance deteriorates due to increased thermal resistance at the solder interface
Solution Approach 1:
The plating film is selectively formed only in the arrangement region where semiconductor devices are mounted, rather than covering the entire heat dissipation base plate surface. This local plating approach provides corrosion resistance at the device interface while maintaining excellent heat dissipation performance in the solder regions, thus resolving the contradiction between corrosion resistance and heat dissipation.
2Strength
If the solder spread region is enlarged to improve bonding area, then bonding strength is improved, but manufacturing precision deteriorates due to difficulty in controlling solder spread boundaries
Solution Approach 1:
The plating film is formed in advance in the arrangement region before soldering. This pre-formed plating layer serves as a controlled interface that guides solder spread, allowing the solder to naturally conform to the plating boundaries. This preliminary action ensures both adequate bonding area and precise control of solder spread, resolving the contradiction between bonding strength and manufacturing precision.
3Reliability
If a recess is formed on the base plate surface to create a penetrating electrode, then electrical connection is improved, but device complexity increases due to additional processing steps
Solution Approach 1:
The plating film is selectively removed from the solder spread regions, extracting only the necessary portions to create electrical connection paths. This approach achieves the function of penetrating electrodes by removing material rather than adding complex structures, thereby improving electrical connection while avoiding the complexity of forming deep recesses and performing multiple polishing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heat dissipation and corrosion resistance, ensuring reliable electrical connections and structural integrity by optimizing the interface between the metal and insulating components, thereby enhancing the overall performance and durability of the semiconductor device.
Implementation Method 1
an alloy layer disposed between the solder and the heat dissipation base plate in the arrangement region, the alloy layer containing a solder component
Implementation Method 2
a first plating film on the principal surface of the heat dissipation base plate, except for the solder region
Data Source
AI summary
A semiconductor device includes an insulated circuit board having a lower surface, a heat dissipation base plate having a front surface that includes an arrangement region in which the lower surface of the insulated circuit board is arranged via solder and a solder region in which the solder spreads over the arrangement region, a plating film formed on the front surface of the heat dissipation base plate except for the solder region, and an alloy layer disposed between the solder and the heat dissipation base plate in the arrangement region. The alloy layer contains a solder component that is contained in the solder. In particular, in the semiconductor device, the plating film is formed on an entire surface of the heat dissipation base plate except for an opening region surrounding an outer periphery of the arrangement region where the insulated circuit board is arranged via the solder.