Compact Base Station Heat Dissipation via 3D Board Arrangement

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Solution Overview

Problem

Conventional compact base stations face challenges in achieving compactness and effective heat dissipation due to the stacking of major components, which leads to larger sizes and heat dissipation issues, particularly with the power amplification unit.

Innovation Solution

The compact base station design arranges boards in three dimensions within an enclosure and utilizes heat dissipation parts on the outer surfaces, allowing for efficient heat transfer and compactness, with power amplification units spaced apart for optimal heat dissipation and filters stacked to enhance antenna characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If major components are stacked one above another to reduce horizontal space, then the vertical height increases and heat dissipation becomes difficult, but the horizontal footprint is reduced

Engineering Contradiction:
Improvehorizontal footprintVSAvoidheat dissipation
Core Design Contradiction:
Area of stationary objectVSTemperature

Solution Approach 1:

The patent transitions from vertical stacking to three-dimensional arrangement on enclosure surfaces. Boards are mounted on inner surfaces and heat dissipation parts are arranged on outer surfaces, utilizing the enclosure's surface area in multiple directions rather than stacking components vertically. This dimensional redistribution reduces both vertical height and improves heat dissipation by exposing more surfaces to ambient air.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The enclosure acts as an intermediary structure that facilitates heat dissipation. Heat dissipation parts are mounted on the outer surfaces of the enclosure, which serves as a thermal interface between the internal components and the external environment. The enclosure's outer surfaces act as mediators that transfer heat from internal boards to ambient air through convection and radiation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If power amplification units are integrated on one board to reduce component count, then the board size increases and heat dissipation problems arise, but the number of separate components is reduced

Engineering Contradiction:
Improvecomponent countVSAvoidheat dissipation
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent segments power amplification units into separate boards rather than integrating them on one board. Multiple independent boards (first board, second board, third board) are mounted on different inner surfaces of the enclosure, distributing heat generation across multiple locations. This segmentation reduces heat concentration and improves dissipation while maintaining manageable component organization.

Inventive Principle:
Principle #1Segmentation

3Reliability

If filter cavities are arranged in a line to maintain antenna characteristics, then the horizontal and vertical dimensions increase, but the antenna performance is maintained

Engineering Contradiction:
Improveantenna characteristicsVSAvoidfilter dimensions
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent arranges filter cavities in a three-dimensional configuration on the enclosure surfaces rather than in a linear arrangement. By utilizing the enclosure's outer surfaces in multiple directions, the filter structure achieves compact dimensions while maintaining the necessary cavity spaces for optimal antenna characteristics. This spatial redistribution reduces both horizontal and vertical footprints.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves a smaller overall size while maintaining performance, effectively addressing heat dissipation and compactness, making it suitable for outdoor use with high output levels.

Implementation Method 1

heat dissipation parts, for example heat sinks, are arranged on the outer surfaces of an enclosure in order to dissipate heat generated from a plurality of boards arranged in three dimensions

Methodology Applied
Scientific EffectHeat dissipation: Thermal Radiation

Implementation Method 2

heat dissipation parts on the outer surfaces, allowing for efficient heat transfer

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP2922307B1Small-sized base station device in mobile communication system
Publication Date: 2020.12.23 KMW INC
  • EP2922307B1 patent drawingFigure 1
  • EP2922307B1 patent drawingFigure 2
  • EP2922307B1 patent drawingFigure 3~4

AI summary

A small-sized base station employed in a mobile communication system is disclosed. To this end, the small-sized base station in a mobile communication system, according to one embodiment of the present invention, is a base station device in a mobile communication system comprising: a case which has the shape of a polyhedron and is hollow inside; a housing accommodated inside the case and having the same polyhedron shape as the case; and at least one board which is positioned between the case and the housing.