Power Module Baseplate Cooling Layout for Uniform Coolant Flow
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Solution Overview
Problem
Existing cooling technologies for power semiconductor modules are inefficient and inhomogeneous, leading to varying temperatures and electrical properties among semiconductor devices.
Innovation Solution
A baseplate design with a cooling channel and flow guide that adapts to the layout of power semiconductor devices, featuring a cooling area opposite each device area and an auxiliary area with a flow guide to reduce coolant flow rate, ensuring homogeneous cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional cooling channel is used with uniform coolant flow, then the cooling structure is simple, but the temperature distribution across semiconductor devices is inhomogeneous
Solution Approach 1:
The cooling channel incorporates a flow guide element that creates locally different flow conditions: high-velocity coolant flow directly beneath heat-generating semiconductor devices for efficient heat removal, and reduced flow velocity in auxiliary areas. This local differentiation of flow quality achieves homogeneous temperature distribution across devices while maintaining a relatively simple overall cooling channel structure.
2Productivity
If coolant flow rate is increased to improve cooling efficiency, then heat dissipation improves, but flow uniformity across different areas deteriorates
Solution Approach 1:
The flow guide element is designed to maintain continuous, controlled coolant flow throughout the cooling channel. It ensures that high-velocity flow continuously passes over heat-generating areas while auxiliary areas receive moderated flow, preventing flow stagnation and maintaining consistent cooling performance across the entire baseplate surface.
Solution Approach 2:
The flow guide creates spatially varying flow characteristics: high velocity regions positioned beneath semiconductor devices for maximum heat dissipation, and low velocity regions in auxiliary areas. This local quality differentiation allows the system to achieve both high overall heat dissipation efficiency and uniform local cooling across all devices.
3Reliability
If cooling channels are positioned to match semiconductor device layout, then cooling effectiveness improves, but manufacturing complexity increases
Solution Approach 1:
The cooling channel is segmented into functional zones by the flow guide element: primary cooling zones positioned beneath semiconductor devices and auxiliary zones with reduced flow. This segmentation allows the cooling channel to be manufactured as a single integrated baseplate structure with simple geometric features, avoiding complex custom channel routing while still achieving device-specific cooling effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves uniform and efficient heat dissipation across semiconductor devices, enhancing their reliability and lifetime by optimizing coolant flow distribution.
Implementation Method 1
the cooling area is adapted for dissipating heat from the baseplate by bringing the cooling area into contact with the coolant flow in the cooling channel
Implementation Method 2
the baseplate comprises in the auxiliary area a flow guide for reducing a flow rate of the coolant flow in the auxiliary area
Data Source
Figure 1~2
Figure 3~4
AI summary
The invention relates to an arrangement (46) comprising a baseplate (10) for a power semiconductor module and a cooler (38), wherein the cooler (38) provides a cooling channel (26) adapted for providing a coolant flow (24), wherein the baseplate (10) comprises a first side (12) adapted for carrying an electronic circuit that comprises at least one power semiconductor device (14), wherein at least one power semiconductor device (14) forms at least one device area (16) on the first side (12), the device area being the footprint of the power semiconductor device (14), wherein the baseplate (10) further comprises a second side (18) located opposite the first side (12), wherein the baseplate (10) comprises on the second side (18) at least one cooling area (20) opposite to at least one device area (16), wherein the at least one cooling area (20) is adapted for dissipating heat from the baseplate (10) by bringing the cooling area (20) into contact with the coolant flow (24) in the cooling channel (26), wherein the baseplate (10) on the second side (18) additionally comprises an auxiliary area (22) located adjacent to the cooling area (20), wherein the auxiliary area (22) comprises a flow guide (28) for reducing a flow rate of the coolant flow (24) in the auxiliary area (22) and wherein the cool- ing channel (26) is adapted for receiving the at least one cooling area (20) and the at least one flow guide (28).