Vehicle Computing Baseplate Cooling for Processor Blade Heat
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Solution Overview
Problem
Autonomous vehicle computing systems face challenges in maintaining optimal operating temperatures, leading to potential damage and reduced service life due to inadequate heat management, which affects performance and reliability.
Innovation Solution
The implementation of a cooling baseplate system with parallel planar surfaces and cooling channels, coupled with a cooling fluid source, to efficiently transfer heat from processor and coprocessor blades to a cooling fluid, utilizing thermally conductive materials and flexible connectors for data and power transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling baseplate system with cooling channels is implemented, then heat management effectiveness is improved, but device complexity increases
Solution Approach 1:
The cooling baseplate merges multiple functions into a single integrated component: it serves as both the cooling system and the mounting structure for processor and coprocessor blades. The baseplate combines thermal conduction pathways with mechanical support functions, eliminating the need for separate cooling plates and mounting brackets, thus improving temperature control without proportionally increasing device complexity.
Solution Approach 2:
The cooling baseplate is designed as a multi-functional component that simultaneously provides thermal management, structural support, and electrical connectivity pathways. The same baseplate structure that conducts heat away from processors also serves as the mounting platform for multiple computing devices, maximizing utility while minimizing additional complexity.
2Temperature
If processor blades and coprocessor blades are mounted on parallel surfaces, then heat dissipation efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The cooling baseplate incorporates locally optimized thermal conduction pathways positioned directly beneath each processor blade and coprocessor blade mounting location. The cooling channels are strategically routed to provide targeted cooling at each heat-generating component location, ensuring efficient heat dissipation while maintaining practical manufacturing tolerances through localized rather than uniform cooling design.
3Adaptability or versatility
If flexible connectors are used for data and power transfer, then adaptability for system upgrades is improved, but connection reliability may worsen
Solution Approach 1:
The system employs flexible printed circuit board connectors that provide the necessary flexibility for system configuration and upgrading while maintaining reliable electrical connections. These flexible connectors are designed with reinforced connection points and proper routing to minimize signal degradation and connection failures, balancing adaptability with reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat within the autonomous vehicle computing system, reducing the risk of damage, extending component lifespan, and enabling increased performance and reliability, while allowing for flexible system upgrades and maintenance.
Implementation Method 1
The first planar cooling surface can be configured to transfer heat from the processor blade to the cooling fluid via conduction. The second planar cooling surface can be configured to transfer heat from the one or more coprocessor blades to the cooling fluid via conduction.
Implementation Method 2
The at least one cooling channel can be configured to allow the cooling fluid to flow between the inlet and the outlet and provide cooling to the first planar cooling surface and the second planar cooling surface.
Data Source
AI summary
Systems and methods for cooling a vehicle computing system are provided. A computing system can include a cooling baseplate including a first planar cooling surface and a second planar cooling surface. The computing system can further include one or more computing devices including a processor blade positioned on the first planar cooling surface, a coprocessor blade positioned on the second planar cooling surface, and a flexible connector coupled between the processor blade and the coprocessor blade. The flexible connector can be configured to transfer at least one of data or electric power between the processor blade and the coprocessor blade. The first planar cooling surface can be configured to transfer heat from the processor blade to a cooling fluid via conduction. The second planar cooling surface can be configured to transfer heat from the coprocessor blade to the cooling fluid via conduction.