Basic Copper Chloride Particulate Matter Synthesis

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Solution Overview

Problem

The existing methods for synthesizing basic copper chloride result in products with inconsistent copper content and particle size, leading to issues like fugitive dust and agglomeration, which do not meet industry standards.

Innovation Solution

A method to produce basic copper chloride particulate matter with a particle size of 60 μm to 250 μm, comprising at least 97% of the total mass, using a preparation process that involves adjusting the copper concentration in waste etching liquids and maintaining a specific pH range to ensure high copper content and stability, avoiding the use of adhesives and promoting the atacamite or paratacamite crystal form.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional parallel feeding synthesis method is used, then the synthesis process is simple, but the particle size is too small and copper content is inconsistent

Engineering Contradiction:
Improvesynthesis process simplicityVSAvoidparticle size consistency
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by conducting impurity removal and copper content adjustment on waste etching liquids before the synthesis reaction. This pre-treatment ensures that the raw materials have consistent copper content (1-5 g/L) and controlled pH ranges, which directly leads to uniform particle size (60-250 μm) and high copper content (≥58.12%) in the final product, resolving the particle size consistency issue while maintaining process simplicity

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent employs parameter changes by precisely controlling the pH value during synthesis (maintaining pH 2-4 through hydrochloric acid or ammonium chloride addition) and adjusting copper content in the waste etching liquids. These parameter controls ensure consistent reaction conditions, producing basic copper chloride with uniform particle size distribution and high copper content, thereby improving manufacturing precision without complicating the synthesis process

Inventive Principle:
Principle #35Parameter changes

2Length of moving object

If adhesive bonding method is used to increase particle size, then the particle size increases, but the copper content decreases below standard

Engineering Contradiction:
Improveparticle sizeVSAvoidcopper content
Core Design Contradiction:
Length of moving objectVSQuantity of substance

Solution Approach 1:

The patent applies the taking out principle by completely eliminating adhesive agents from the synthesis process. Instead of using adhesives to bond particles, the method synthesizes basic copper chloride directly through controlled chemical reaction between copper-containing solutions and alkaline solutions, with impurity removal and pH control. This extraction of harmful adhesives ensures the product achieves both large particle size (60-250 μm) and high copper content (≥58.12%), meeting national standards without dilution

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent implements self-service by using the waste etching liquids themselves as the primary copper source after impurity removal and concentration adjustment. The copper content in the waste liquids is optimized to 1-5 g/L, and through controlled synthesis with alkaline solutions, the basic copper chloride particles form with desired size and high copper content naturally, without requiring external adhesive materials that would reduce copper content

Inventive Principle:
Principle #25Self-service

3Ease of manufacture

If small particle size basic copper chloride is used, then the synthesis is easier, but fugitive dust occurs during use

Engineering Contradiction:
Improvesynthesis easeVSAvoidfugitive dust
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The patent applies parameter changes by controlling the synthesis conditions (pH 2-4, temperature 20-100°C, controlled addition rates) to produce basic copper chloride particles with optimized size distribution (60-250 μm). This parameter control ensures particles are large enough to minimize dust generation during handling and use, while maintaining synthesis feasibility and high copper content (≥58.12%), thus resolving the conflict between synthesis ease and dust prevention

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves a stable, high-copper-content basic copper chloride product with reduced dust and agglomeration, meeting industry standards and maintaining product consistency under high temperature and humidity conditions.

Implementation Method 1

synthesizing basic copper chloride in a parallel feeding manner under heated conditions

Methodology Applied
Scientific EffectPrecipitation: Precipitation

Implementation Method 2

promoting the atacamite or paratacamite crystal form

Methodology Applied
Scientific EffectCrystallization: Crystallisation

Implementation Method 3

under heated conditions

Methodology Applied
Scientific EffectHeating: Heating

Data Source

PatentUS11746023B2Basic copper chloride particulate matter and preparation method therefor
Publication Date: 2023.09.05 GUANGZHOU KECHENG ENVIRONMENTAL PROTECTION TECH
  • US11746023B2 patent drawing
  • US11746023B2 patent drawing
  • US11746023B2 patent drawing

AI summary

Disclosed are basic copper chloride particulate matter and a preparation method therefor. The basic copper chloride particulate matter is mainly composed of basic copper chloride particles, and the basic copper chloride particles, with a particle size of 60-250 μm, in the basic copper chloride particulate matter comprise 97% or more of the total mass of the basic copper chloride particulate matter.