Batch Assembly Apparatus Handling Units Spring Expansion
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Solution Overview
Problem
Current surface mount technology (SMT) pick-and-place machines and mechanical spreaders face challenges such as time-consuming processes, high stress on sensitive wafers, limited expanding modes, and accuracy issues, particularly when handling ultra-fine pitches and asymmetric components.
Innovation Solution
An apparatus comprising handling units connected by spring units, with a motion controller and stabilizing elements, allowing for batch assembly and expansion of devices in multiple directions, including the use of multi-step positioning mechanisms and curved surfaces for precise device placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pick-and-place machines are used for device assembly, then placement precision is improved, but processing time increases and cost increases
Solution Approach 1:
The apparatus segments the handling system into multiple independent handling units, each capable of holding and positioning devices. These units can operate in parallel to process multiple devices simultaneously, thereby improving productivity while maintaining the precision of individual placement operations through controlled movement mechanisms.
Solution Approach 2:
The invention combines multiple handling units into a single integrated apparatus that can process multiple devices in batch. By merging the functionality of multiple pick-and-place operations into one coordinated system, the apparatus achieves both high precision (through controlled movement) and high productivity (through parallel processing of multiple devices).
2Object-affected harmful factors
If plastic diaphragms are used for packaging electronic components, then component protection is improved, but stress on sensitive wafers increases and expanding flexibility is limited
Solution Approach 1:
The apparatus uses controllable movement mechanisms to adjust the expansion parameters of the handling units gradually and uniformly. This controlled parameter change allows the system to expand from a compressed state to an expanded state without inducing high stress on sensitive wafers, while still providing adequate protection during transport.
Solution Approach 2:
The handling units are designed with dynamic movement capabilities, allowing them to transition between compressed and expanded states in a controlled manner. This dynamic approach replaces the static, one-time-use plastic diaphragm with a reusable system that can adapt its expansion level to protect components while minimizing stress.
3Ease of repair
If mechanical spreaders are used for batch die transferring, then reusability is improved, but manufacturing complexity increases and accuracy decreases
Solution Approach 1:
The apparatus replaces complex mechanical mechanisms (such as elastically variable pitch screws) with a simpler system based on controllable movement of handling units. This substitution maintains reusability while reducing manufacturing complexity and improving accuracy by eliminating the need for complex adjustment mechanisms.
4Adaptability or versatility
If mechanical spreaders with elastically variable pitch screws are used, then adaptability to different pitches is improved, but manufacturing complexity and assembly tolerance issues increase
Solution Approach 1:
The apparatus achieves pitch adaptability through parameter changes in the movement control system rather than through complex mechanical adjustments. The controllable movement mechanisms can adjust the spacing between handling units to match different device pitches, providing versatility without the manufacturing complexity and tolerance issues of mechanical spreaders.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient batch assembly and transfer of devices with improved accuracy and reduced stress, accommodating various device densities and pitches, while maintaining precision and reliability.
Implementation Method 1
a plurality of spring units connected to the plurality of handling units. In one embodiment, at least one of the spring units is connected between adjacent handling units
Data Source
AI summary
The present disclosure is directed to an apparatus and method of batch assembly. The apparatus for batch assembly may include a plurality of spring units, a plurality of handling units, and a control unit. The method of batch assembly may include aligning an array of devices with a plurality of handling units, attaching the array of devices onto the handling units, expanding the handling units so as to expand the array of devices from a first area to a second area, and transferring the array of devices to a destination.