Batch Brush Cleaning for Semiconductor Wafers
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Solution Overview
Problem
Conventional batch-type cleaning methods for semiconductor substrates have lower particle removal capability compared to single-wafer-type methods, limiting the throughput of wafers that can be cleaned per unit time, as they clean wafers one by one, including both sides, which reduces efficiency.
Innovation Solution
A batch-type brush cleaning apparatus with multiple roll brushes rotating in contact with both sides of multiple semiconductor substrates, using a transfer mechanism to hold wafers at predetermined intervals and a driving unit to rotate the brushes, employing an alkaline aqueous solution to prevent particle re-adhesion, and utilizing a drying chamber for efficient cleaning and drying of 25 wafers simultaneously.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If single-wafer-type cleaning method is used to clean wafers one by one, then particle removal capability is improved, but productivity deteriorates
Solution Approach 1:
The cleaning apparatus divides the cleaning function into multiple independent roll brushes (first roll brush, second roll brush, third roll brush, fourth roll brush) that can simultaneously clean multiple wafers. Each brush is responsible for cleaning specific regions of multiple wafers, enabling parallel processing while maintaining high particle removal capability through mechanical brushing action.
Solution Approach 2:
The invention combines multiple cleaning functions into a single batch-type cleaning chamber where multiple wafers are cleaned simultaneously. The transfer mechanism merges wafer transport with the cleaning process, and the drying mechanism merges drying function with the same chamber, enabling integrated cleaning and drying of multiple wafers in one operation cycle.
2Productivity
If batch-type cleaning method is used to clean plural wafers at one time, then productivity is improved, but particle removal capability deteriorates
Solution Approach 1:
The roll brushes are designed to rotate dynamically during the cleaning process, with each brush rotating in its own direction to create effective mechanical cleaning action. The transfer mechanism also moves dynamically to position wafers at predetermined intervals, ensuring optimal contact between brushes and wafer surfaces while maintaining high particle removal capability across all wafers simultaneously.
3Manufacturing precision
If wafers are cleaned one by one in single-wafer-type apparatus, then particle removal capability is improved, but loss of time increases
Solution Approach 1:
The batch-type cleaning apparatus enables continuous cleaning of multiple wafers in parallel without interruption. While one set of wafers is being cleaned, the transfer mechanism prepares the next set, and the drying mechanism operates continuously on cleaned wafers. This eliminates idle time between individual wafer cleaning cycles, significantly reducing Turn Around Time while maintaining effective particle removal through the brush cleaning action.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively increases the throughput by cleaning and drying multiple wafers simultaneously, improving the particle removal capability and reducing Turn Around Time (TAT), while preventing particle re-adhesion using an alkaline solution, thus enhancing the overall cleaning efficiency.
Implementation Method 1
plural roll brushes (501) cleaning surface of the semiconductor substrates W, the longitudinal directions of the roll brushes being oriented in parallel relative to the front sides and the back sides
Implementation Method 2
A particle removal capability of the cleaning method using the brush is the most excellent among those cleaning methods
Implementation Method 3
employing an alkaline aqueous solution to prevent particle re-adhesion
Data Source
AI summary
Transferring plural semiconductor substrates under a state being held with predetermined intervals; holding the plural semiconductor substrates with roll brushes provided in plural pieces by each front side and back side of the plural semiconductor substrates, longitudinal directions of the roll brushes being oriented in parallel relative to the front side and the back side; and cleaning the plural semiconductor substrates by rotating the plural roll brushes.